ET-668系列免洗錫膏 ET-668 无铅锡膏/Lead-free Solder PasteET－668无铅锡膏系列采用特殊的助焊液与氧化物含量极少的球形合金粉炼制而成。具卓越的连续印刷解像性；此外，本制品所含有之助焊膏，采用具有高信赖的低离子性卤素之活化剂系统，使其在回焊之后的残渣，即使免洗也能拥有极高的可靠性ET - 668 Lead Tin paste series use special help with the welding oxide content of the spherical little  alloy powder refining form. A continuous printing definition of excellence; In addition, the products of which help contain stencil, using a high trust and low halogen ions of the active agent system, so that in the back after welding residue, can have even disposable high reliability 1、印刷特性/Printing  characteristic1.)连续印刷时，其沾度极少经时变化，可获得非常稳定印刷。Has the best stability character when continued printing.
 2.)对0.3mm及以上间距的电路，可完成精美的印刷。
 Can get high quality printing when the distance of circuit 0.3mm 
3.)拥用极佳焊接性，可在不同部位表现出适当的沾湿性。
 Has the excellent jointing character, bedewed character can be put up in different part s.4.)可适当用于一般大气下与氮气之回焊炉。Can be propriety soldered in stove with azotes 
5.)于极高之尖峰温度下，亦能获得良好的焊接性。Has the best jointing when make it in the extra-temperature 2、成分与特性
/Component and Characteristic 
ET－668无铅锡膏的各种特性，如表—1及表—2
 ET-668 characteristic of lead-free solder paste , see below chart 1 and below chart2表—1/below chart 1项  目Subject特
性 Character合金成份Alloy component锡42/铋58tin 42/ Bismuth58熔  点Flux Content138℃锡粉颗粒度degree of the tin power grain25—45/μm锡粉的形状tin powder shape球  状 /ball shape金属含量metal content85~91wt%（± 0.5）卤素含量Halide Comtent＜0.2wt%沾  度ViscosityT3,90%metal for printing 表—2 /below chart2项目subject特性character电迁移试验electro migration test1.02×105Ωcm以上Above 
1.02×105Ωcm绝缘电阻试验insulation resistance test1×109.Ω以上Above 1×109.Ω流移性试验Current test低于0.2mmBelow  0.2mm 熔融性试验Flux test几无锡球发生No tin ball happened扩散率试验diffusivity test88%以上Below  88%铜镜腐蚀试验Copper mirror rust test无穿透腐蚀No rust残渣沾性试验scrap viscosity test合格Up to grade 3．品质保证期限/Quality guarantee time 品质保证期限为制造后180天，但必须密封保存于5-10℃及75%RH以下。Quality guarantee time is 180 days after made , but must be airproofed below5-10℃and75%RH