以聚酰亚胺为材质的支撑桥和焊锡大坝。 Polyimide PropertiesTensile StrengthMpa215Young’s ModulusGpa2.5Tensile Elongation%85Glass Transition TemperatureoC285Thermal Decomposition TemperatureoC525Coefficient of Thermal Expansionppm/oC55Coating Stress (100 silicon)MPa33Dielectric Constant 1MHz; 0%/50% RH 3.2/3.3Dissipation Factor 1MHz; 0%/50% RH 0.003/0.008Dielectric StrengthV/µm345Moisture Absorption @ 50% RH%1.08Densityg/cc1.39Refractive Index @ 633nm 1.69
