ATP是激光二极管安装和调整数据传送线，从1.0到40吉比特的应用中处于地位。ATP根据客户要求生产薄膜基片，ATP库存多种不同厚度的材料，该材料经过严格控制，以供应激光二极管排列需要。这些库存包括高导热材料，如：氮化铝、氧化铍，低损耗材料如：熔凝硅、石英和蓝宝石。这些晶片粘贴可以包括预先镀层和有图形的金锡合金，以用于减少成本量产，自动化装配的激光二极管模块。利用预先镀层和图形的金锡合金替代传统预成形的金锡合金。ATP标准的合金比例是金80%、锡20%，熔点在280°C。ATP内部能力包括二套先进的工艺多头C02激光以制造复杂共面结构。
Replaces Traditional Au/Sn Preform \\取代传统的Au/Sn预成形•
Accurately Controlled Thickness厚度精确控制•
Lot to Lot Consistency批次到批次的一致性•
Reduce Au/Sn Thickness金/锡厚度减少•
Homogeneous 80% Au/20% Sn，均匀的80% / 20%锡金•
Complex Solder Pad Geometries复杂焊垫几何形状•
Accurate Laser Alignment精准的激光定位
SubstrateMaterial基片材料
氮化铝
170 W/mk导热系数
200 W/mk导热系数
< 2µ" (50nm)表面光洁度
Beryllium Oxide (BeO) /氧化铍
270 W/mk可导热
2µ"–4µ" (50nm–100nm)表面光洁度
Alumina Oxide /氧化铝
导热系数26.9 W/mk
小于< 1µ" to 3µ" (< 25nm–75nm)的表面光洁度
Metalizations
TiW/Au: 400–1,000Å (40nm–100nm)/100µ" (2.5 microns) min.
TiW/Ni/Au: 400–1,000Å (40nm–100nm)/1,000-2,000Å (100nm–300nm)/100µ" (2.5 microns) min.
TiW/Pd/Au: 400–1,000Å (40nm–100nm)/1,000-2,000Å (100nm–300nm)/100µ" (2.5 microns) min.
Pre-deposited and Patterned Au/Sn Guidelines
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Smallest Feature Size: 0.002" x 0.002" (0.078mm x 0.078 mm)
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Minimum Pitch ( minimum space between Au/Sn Pads): 0.002" (0.078mm)
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Maximum Au/Sn Thickness: 400µ" (10 microns)
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Typical Au/Sn Thickness: 160–200µ" (4–6 microns)
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Minimum Au/Sn Thickness: 80µ" (2 microns)
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Tolerance on Thickness of Au/Sn: ±80µ" (± 2 microns)
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Placement Accuracy of Au/Sn: ± 0.0005" (±0.0127mm)
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Dimensional Tolerance on Au/Sn Pad: ± 0.0002" (±0.005mm)
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Minimum Pull Back from Laser cut edge: 0.005" (0.127mm)
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Minimum Pull Back From Conductive Plated Thru Via Holes: 0.005" (0.127mm)
