大功率LED专用导电银胶，双组份，无需冷藏，方便运输\\操作，室温寿命长，导热29W，产地美国。

Product Description:

H20Eis a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. It has proven itself to be extremely reliable over many years of service and is still the conductive adhesive of choice for new applications.

vantages & Application Notes:

• Especially recommended for use in high speed epoxy chip bonding systems where

• Suggested for JEDEC Level III and II for plastic IC packaging.

• NASA approved and is NON TOXIC—complying with USP Class VI Biocompatibility

• Capable of resisting TC wire bonding temperatures in the range of 300°C to 400°

• Ease of use; apply by dispensing, screen printing, die-stamping, or by hand.

• Especially suited for high power devices and high current flow. High power LEDs.

• Opto-electronic packaging material: LED, LCDs, and fiber optic components.

Typical Properties:

To be used as a guide only, not as a specification. Data below is not guaranteed. Different batches, conditions and applications yield differing results; Cure condition: 150°C/1 hour; *denotes test on lot acceptance basis.

Physical Properties:

Color:                               Part A: Silver   Part B: Silver

Consistency:                          Smooth, thixotropic paste

Viscosity (@ 100 RPM/23°C):            2,200 – 3,200 cPs

Thixotropic Index:                      3.69

Glass Transition Temp.(Tg):              ≥ 80°C (Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min)

Coefficient of Thermal Expansion (CTE):   Below Tg: 31 x 10-6in/in/°C ;     Above Tg: 158 x 10-6in/in/°C

Shore D Hardness:                      75

Lap Shear Strength @ 23°C:              1,475 psi

Die Shear Strength @ 23°C:              > 5 Kg / 1,700 psi

Degradation Temp. (TGA):               425°C

Weight Loss:                          @ 200°C: 0.59%; @ 250°C: 1.09%; @ 300°C: 1.67%

Operating Temp:                       Continuous: -55°C to 200°C;     Intermittent: -55°C to 300°C

Storage Modulus @ 23°C:                808,700 psi

Particle Size:                           ≤ 45 Microns

Based on Thermal Resistance Data:         R = L x K-1x A-1

Number of Components:             Two

Mix Ratio By Weight:                1:1

Specific Gravity:                    Part A: 2.03  Part B: 3.07

Pot Life:                           2.5 Days

Shelf Life:                         One year at room temperature

Electrical Properties:

Volume Resistivity @ 23°C:    ≤ 0.0004 Ohm-cm

Thermal Conductivity:       29 W/mK

Minimum Bond Line Cure Schedule*:

175°C@20Minutes;   150°C@30Minutes;   120°C@60 Minutes;