10W大功率集成光源
芯片:晶元30MIL
亮度:85-95LM/W
色温:暖白 2900-3000K
正白 5500-6000K
冷白 7000-7500K
串并方式:10串1并
电压:32-34V
电流:320MA
进口正规芯片封装,1.2高品质金线焊接,质保3年。
可找第三方检测机构进行检测,如芯片不对假一赔百。
1.Test Items And Results
(测试项目与结果)
| Test Item (测试项目) | Reference Standard (参考标准) | Test Conditions (测试条件) | Test Hours/cycle (测试时间/周期) | Units Tested (单位) | Ac/Re (允收标准) |
Operation Test (操作测试) | Operating Life Test (寿命实验) | | TA=25℃±5℃,IF=350mA | 1000 Hrs | 22 | 0/22 |
Environment Test (环境测试) | High Temperature Storage (高温储存) | JEITA ED-4701 200 201 | TA=100℃±5℃ | 1000 Hrs | 22 | 0/22 |
Low Temperature Storage (低温测试) | JEITA ED-4701 200 201 | TA=-40℃±5℃ | 1000 Hrs | 22 | 0/22 |
High Temperature.& Humidity Storage 高温高湿储存 | | TA=85℃±5℃, RH=85%±5%RH | 1000 Hrs | 22 | 0/22 |
Thermal Shock (冷热冲击) | JEITA ED-4701 300 307 | -40°±5℃çè+85℃±5℃ 30min dwell / 5 min transfer | 50 Cycles | 22 | 0/22 |
Soldering Test (手工焊接测试) | Solder ability (焊接性) | | 350±5℃,5±1 sec | 1 time Over 95%Wetting | 22 | 0/22 |
Resistance to Soldering Heat (耐焊性) | | 350±5℃,5±1 sec | 1 time | 22 | 0/22 |
2.Failure criteria
(失效标准)
- Electrical Failures:
(电性失效)
- VF>±10%(电压值>±5%)
- IR(VR=5V)>10uA(反向电流>10uA)
- Light Output Degradation:
(光通量衰减)
- Flux Degradation% >10% max ;>3% average
(光通量最大衰减>10%;平均衰减>3%)
- Visual Failures:
(外观不良)
- Broken or damaged package or lead(包装破损)
- Solder ability < 95% Wetting(有效焊接面积< 95%)
- Dimension out of tolerance(尺寸超出公差)
- Discolor of lens(透镜变色)
■Note:It is required that the LEDs should be attached heat-sink when these LEDs are Operating.
(备注:以上这些是要求在操作LED的过程当中要重视散热的问题)