本公司芯片都是采用台湾进口超高亮大尺寸晶片，产品制造过程采用净化,抗静电的国际标准设施封闭作业。
拥有业内最先进的ASM全自动固晶、全自动焊线设备及全自动封胶设备，产品检测选用台湾多功能电脑
自动分光分色设备 处理
采用全自动化控制流程;1自动固晶 2自动焊线 3自动点荧光胶 4自动灌胶 5自动分光，分色
■ Absolute Maximum Rating极限工作参数
Parameter | MAX. | Unit |
Power Dissipation | 100 | mW |
Peak Forward Current (1/10 Duty Cycle, 0.1ms Pulse Width) | 50 | mA |
Continuous Forward Current | 20 | mA |
Derating Linear From 50℃ | 0.4 | mA/℃ |
Reverse Voltage | 5 | V |
Operating Temperature Range | -40℃ to +85℃ |
Storage Temperature Range | -40℃ to +270℃ |
Lead Soldering Temperature [4mm(.157”) From Body] | 260℃ for 5 Seconds |
■ Electro-Optical Characteristics (Ta=25℃)光电特性参数
Parameter | Symbol | Min. | Typ. | Max. | Unit | Test Condition |
Luminous Intensity | IV | 1000 | 1100 | 1200 | mcd | If=60mA (Note 1) |
Viewing Angle | 2θ1/2 | --- | 120 | --- | Deg | (Note 2) |
Wavelength 波长 | WD | 620 | 623 | 625 | nm | IF=20mA (Note 3) |
| | | | | | | IF=20mA (Note 3) |
Forward Voltage | VF | 2.0 | 2.2 | 2.4 | V | IF=20mA |
Reverse Current | IR | --- | --- | 10 | µA | VR=5V |
