LFSOLDER TLF-204F-111S is PB-fress solder paste using Pb-free,spherical solder powder and special flux.Even if this paste corresponds to the fine pattern,because the small solder powder is used excellent printability is obtained.As the paste contains no Pb,it will largely contribute to the protection of global environment.Furthermore,excellent reliability can be obtained with the flux without washing.
Outstanding Features
l Pb-free(Sn/Ag/Cu series) solder alloy is used.
l Excellent printability can be attained at fine pattern of0.4mmpitch CSP,because the small solder powder is used.
l Stable printability is pbtained with little change in viscosity during continuous printing.
l Having a good solderability,adequate wettability is shown on various parts.
l Excellent solderability can be attained for a high peak temperature.
Characteristics
|
Items |
Characteristics |
Test methods |
|
Alloy composition |
Sn96.5/Ag3.0/Cu0.5 |
JIS Z 3282(1999) |
|
Melting point |
216~220℃ |
According to DSC measurement |
|
Particle size of solder powder |
10~30μm |
According to laser diffraction method |
|
Shape of solder powder |
Spherical |
Annex 1 to JIS Z 3284(1994) |
|
Flux content |
11.80% |
JIS Z 3284(1994) |
|
Chlorine content |
Less than 0.10% |
JIS Z 3197(1999) |
|
Viscosity |
200pa.s |
Annex 6 to JIS Z 3284(1994) |
|
Viscometer,type PCU,manufactured by | ||
|
Malcom,at25℃ |
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