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Storage
mended storage environment
Temperature: 5oC ~ 30oC (41oF ~ 86oF)
Humidity: 60% RH Max.
Use within 2 days after opening of sealed vapor/ESD barrier bags.
If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions.
Baking treatment : 70±5℃for 24 hours.
Fold the opened bag firmly and keep in dry environment.
Soldering
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*After reflow soldering rapid cooling should be avoided.
[Temperature-profile (Surface of circuit board)]
Use the conditions shown to the under figure.
＜1 : Lead Solder＞ ＜2 : Lead-free Solder＞
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[ mended soldering pad design ]
Use the following conditions shown in the figure.
Handling of Silicone Resin LEDs |
Handling Indications |
During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound |
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Figure 1 |
In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also e scratched. |
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Figure 2 |
When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. |
Dimensions for Tape
Dimensions for Reel
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Notes:
1.All dimensions are in mm, tolerance is±2.0mm unless otherwise noted.
2.Specifications are subject to change without notice.
Packing
Notes:
1.All dimensions are in mm, tolerance is±2.0mm unless otherwise noted.
2.Specifications are subject to change without notice.
