三科斯高导热硅胶垫厂家-高品质高服务导热硅胶垫厂家4000168070！

hermal conductive principle:

Typical applications:

◆LED industry

●Thermal conductive silicone pad for the gap betweenaluminum plate and heat sink

●Thermal conductive silicone pad for the gap betweenaluminum plateand outer covings

◆Power supplyindustry

●The heat conduction betweenMOStube,transformer( orcapacitance/PFC electricInductance) and heat sink or out covings

◆Communication industry

●The heat conduction of TD-CDMA between the IC mainboard and heat sink or outer covings

●The heat conductionbetween Set-top box DC - DC IC andouter coving

◆Automobile electronic industry

●Thermal conductive silicone pad forAutomobile electronic industry application (xenon lamp ballast,stereo equipment,On-boardproductsseries, etc. )

◆PDP/LED TV

●The heat conductionbetween amplifier IC,image decoder IC and heat sink (outer coving)

◆Household appliance industry

●Microwave oven/ air condition(between Fan motor power IC andouter coving /Induction

cooker(betweenInduction cooker thermistorand heat sink)

Product profile:

3K500 -600 high performance, thermally conductive silicon pad

The 3K500 high performance, thermally conductive

silicon pad designed withextremely high thermal

conductivity and coherent winding, its thermal

conductivity in the thermally conductive gap filling

materials is unparalleled.

Features & benefits:

●High compressibility, soft and flexible, designed for

applications in low-stress application environment

●Nice thermal conductivity

● Electrical insulation

● Meet with the environmental requirements of ROHS and UL

● Natural stickiness

Typical applications:

● Laptop

●Communication hardware equipment

●High-speed hard disk drive equipment

●Automobile engine control mould

●Micro processor, memory chip and graphics processor

● Mobile equipment

Physical properties:

Configurations available: 200mm*400mm, 300mm*400mm; specific size could be provided

ording to your requirements.