Item

Value

 DC Voltage VDC

10V

 AC Voltage VPP

10V (50Hz/60Hz)

 Operation Temperature

-40℃to +85℃

 Storage Temperature

-45℃to +85℃

 RF Power Dissipation

0dBm

Item

Unit

Minimum

Typical

Maximum

Center Frequency (fo)

MHz

314.925

315.000

315.075

Insertion Loss

dB

—

1.5

2.5

Quality Factor

—

—

—

—

Unloaded Q

—

—

12,800

—

50Ω Loaded Q

—

—

2,000

—

Temperature Stability

—

—

—

—

Turnover Temperature

℃

10

25

40

Frequency Temperature Coefficient

ppm/℃2

—

0.032

—

Frequency Aging

ppm/yr

—

<±10

DC Insulation Resistance

MΩ

1.0

—

RF Equivalent RLC Model

—

—

—

—

Motional Resistance R1

Ω

—

18

26

Motional Inductance L1

μH

—

66

—

Motional Capacitance C1

fF

—

2.3

—

Shunt Static Capacitance C0

pF

1.4

1.7

2.0

5.1 Resistance to Soldering heat:

5.1.1 The components shall remain within the electrical specifications after it soldered on the 1mm-thickness PCB board and dipped in the solder at 260℃±5℃ for 10±1 seconds.

5.1.2 The components shall remain within the electrical specifications after it soldered by electric iron, solder at 350℃±10℃ for 3~4 seconds, recovery time : 2h±0.5h.

5.2 Thermal Shock:

The components shall remain within the electrical specifications after being kept at the condition of heat cycle conditions: TA=-40℃±3℃, TB=85℃±2℃, t1=t2=30min, switch time≤3min & cycle time : 100 times, recovery time : 2h±0.5h.

5.3 The Temperature Storage:

5.3.1 High Temperature Storage: The components shall remain within the electrical specifications after being kept at the 85℃±2℃for 500 hours, recovery time : 2h±0.5h.

5.3.2 Low Temperature Storage: The components shall remain within the electrical specifications after being kept at the –40℃±3℃for 500 hours, recovery time : 2h±0.5h.

5.4 Humidity test:

The components shall remain within the electrical specifications after being kept at the condition of ambient temperature 60℃±2℃, and 90~95% RH for 500 hours.

5.5 Drop test:

The components shall remain within the electrical specifications after random free drops 10 times from height of 1.0 meter onto concrete floor, and the specimens shall meet the electrical specifications in table 5, external visual inspection.

5.6 Solderability test:

at the condition of temperature 245℃±5℃Depth: DIP 2/3 , SMD 1/5, time: 3.0s-5.0s,80% or more of the immersed surface shall be covered with solder and well-proportioned.

5.7 Vibration Fatigue:

The components shall remain within the electrical specifications after loaded vibration at 10~55Hz, amplitude 1.5mm, X, Y, Z, direction, for 2 hours.

5.8Terminal strength:

The force 10±1seconds of 19.6N is applied to each terminal, and 45°in the same direction 2 times with 2N bending force (Exception: SMD)

5.9 Mechanical Shock:

The components shall remain within the electrical specifications after 1000 shocks, eleration 392 m/s2, duration 6ms.

Note: As a result of the particularity of inner structure of SAW products, it easy to be breakdown by electrostatic, so we should pay attention to ESD protect in the test.