PRODUCT DATA SHEET
RS-1128 One Component Epoxy Relay Sealant
Rev.:2011-10
RS-1128 is a black, low temperature-cured, one component, thixotropic, 100% solid, liquid epoxy adhesive and insulating compound. The low shrinkage, high performance in strength and adhesion force makes it ideal for using as sealants (e.g. relay sealant). RS-1128 can be cured even at 85°C. Ability to have lower temperature cure also means minimization of expansion and contraction during and after curing, which give better protection for electronics in components. RS-1128 has good adhesion on plastics and ceramics.
RS-1128 has excellent shelf stability of 3 months in 0-5°C. It is also a “RoHS” compliance product containing no banned substances. |
PROPERTIES:
LIQUIDSTATE |
|
Technology Components Viscosity Thixotropic Index Appearance Specific Gravity (@770F) Work Life (when opened) Shelf Life @ 0-5°C | Epoxy ponent 45,000cPs 1.5 Black, thixotropic liquid 1.5 12 hours 3 months |
CURED STATE |
|
Appearance (depends on curing parameter) ServiceTemperature Range CTE (Coefficient of Thermal Expansion) Shore Hardness (25°C) Volume Resistivity Tensile Shear (Al/Al, ASMT D-1002) | Black solid -40°C – 130°C <70ppm/°C >85 Shore D 6 x 1014ohms / cm (@25°C) > 1500 psi |
STORAGE AND SHELF LIFE:
0– 5°C | 3months |
Store in cool, dry location. Keep container tightly sealed when not in use. Keep away from heat sources (including direct sunlight). If stored properly, above shelf-life can be attained. Store in temperature higher then suggested temperature will shorten shelf-life significantly. |
APPLICATION AND CURE CHARACTERISTICS:
RS-1128 may be applied manually, semi-auto dispensing system or automatic dispensers. RS-1128 has excellent adhesion to a variety of materials. Typically it is cured in an elevated temperature circulating air oven.
syringe : ~ 1 hour syringe : ~ 1.5 hours 1kg bottle / can : ~ 2.5 hours 1 Gallon can : ~ 4 hours
NOTE: ANY TEMPERATURE LOWER THAN 85°C IS NOT MENDED. IR ovens may have shorter cure schedule but the time varies from machines to machines. The above schedule does not consider the uneven distribution of temperature in ovens, and not yet includes the ramp-up time for hot plate / oven. Customer should add buffer ording to their performance of their equipments. |
SAFETY AND HANDLING PRECAUTIONS:
Refer to MSDS. |
DECLARATION:
Values listed in this TDS are averages only, and data listed in this specification are urate to the best of our knowledge. EMEI does not assume any liability whatsoever for the uracy or completeness of the information herein and does not guarantee the material is suitable for users’ specific application. In the interest of achieving optimum properties, the cured physical properties were developed by using a cure schedule of half hour at 150°C in experimental environment. User should decide their own cure schedule and production precaution ording to actual production resources.
Use the material with caution. The TDS and MSDS both describe known hazards of the product but there may be unknown health hazards related to the product, we cannot guarantee that these are the only hazards that exist. |