Application Ideas
• Mask for protection of gold fingers of printed circuit boards during wave solder or solder dip process.
• Release surface in fabrication of parts cured at elevated temperatures.
Features
•  At room temperature, the properties of Kapton® and polyimide polyester films are similar, however, as the temperature
increases or decreases, the properties of the Kapton® film are less affected than polyester.
• Kapton® film does not soften at elevated temperatures, thus the film provides an excellent release surface at elevated
temperatures.
• RoHS compliant.

Typical Physical Properties
Note: The following technical information and data should be considered representative or typical only and should not be used
for specification purposes.
ASTM Test Method
Adhesion to Steel: 22 oz./in. width (24 N/100 mm) D-3330
Tensile Strength at Break: 33 lbs./in. width (578 N/100 mm) D-3759
Elongation at Break: 62% D-3759
Backing Thickness: 1.0 mil (0.03 mm) D-3652
Total Tape Thickness: 2.7 mil (0.07 mm) D-3652
Temperature Use Range: -100° to 500°F (-73° to 260°C)
Dielectric Strength: 7000 volts D-149
Outgassing: %TLM = 1.50; %CVCM = 0.50 E-595
Flame Retardancy: Pass per UL-510
product category:
OANZ2
File E230409