Electrically Conductive Epoxies
Die attach
Surface mount
60-85 wt% Silver or Silver-Palladium
Volume Resistivity:   0.001 to 0.00005 ohm-cm
Thermally Conductive Epoxies
Die attach and Lid attach
Surface mount
50-85 wt% alumina, aluminum nitride, boron nitride, diamond
Thermal Conductivity:   1 to 10 watt/m-°K
Anisotropically Conductive Epoxies
COG and TAB bonding
MEM’s and CCD attachment
5-15 wt% mono-sized conductive particles
Glob Top Encapsulants
80 to 85 wt% silica filler
Covers and protects die
Dam & Fill Encapsulants
80 to 85 wt% silica filler
Covers and protects die
Underfill Encapsulants
60 to 75 wt% silica filler
Encapsulates and protects solder joints