1. Scope

   This specification covers the resin-cored solder .

   ECO SOLDER RMA98 SUPER P3 M705, wire-formed lead-free solder alloy “M705”,

   In which resin flux is used in the core, used for wiring connection and so on, of electric

   and electronic parts.

2. Standard

   2.1 Chemical composition of solder alloy (Test method: STM-9-1 )

      Composition and impurity are prescribed as the following tables.

                Composition (mass %)
            Ag             Cu             Sn
         3.0±0.1        0.5±0.05      Balance

                                    Impurities (mass % or less)
          Pb          Sb         Bi         Zn         Fe         Al         As         Cd
         0.10        0.12       0.10      0.002      0.02        0.002       0.03      0.002

   2.2 Melting temperature range and specific gravity of solder alloy.

                                                                    (Reference value)

       Melting temperature range      ℃       Specific gravity

               Approx 217~220                   Approx 7.4

   Date of Establish / Revision                                 Approva1

  2.3     Characteristics of flux

                  Items                       Performance / Standard                Test method

      Flux content (mass%)                           2.7 ~ 3.3                    STM-5-1

     Numbers of cores                                Single core

                                     Flux shall be uniformly formed in
      State of core                  lengthwise direction without any            STM-6
                                     resin shortage being noticed.
                                     Chalk powder shall be easily
      Dryness test                   removable from any of the test              STM-26
                                     places.
      Halide content in flux
                                                    0.14 or less                 STM-27
      (mass %)
                                     The silver chromate paper’s color
      Chlorine and Bromide           shall not change to gray-white or           STM-27-1
                                     yellow-white.

                                     Any of the test pieces shall not have
      Copper plate corrosion
                                     corrosion greater than of the               STM-28
      test
                                     reference test piece.

       Copper mirror or              There shall be no complete removal
      copper-plated sheet            of copper film which makes the              STM-29
      corrosion test                 background white and transparent.
      Insulation resistance                             12
                                                  1x 10   or more                 STM-30-5
                            ( Ω)
      Voltage impression
                                     There shall be no noticeable
      Moisture resistance                                                        STM-31
                            ( Ω)     corrosion in any part of a test piece.

      Solution resistance
                                                   1000 or more                  STM-32-1
                            ( Ω)

      Spreading rate        (%)                      75 or more                  STM-33

2.3   Appearance (Test Method :STM-1_)
    (1)The surface shall be smooth and glossy uniformly. Extremely poor glass.
        And adhesion of foreign matters and dirt, shall not be found.
    (2)Significant scratches, cracks, tears, and surface oxidization, shall not be
        found.
    (3)Noticeable coiling collapse shall not be found.
    (4)There shall be no joint part about products with diameter Φ 0.8mm of
        more
    (5)No joint part shall be thicker than the base wire solder.

As for Good /N.G. judgement , limitation sample shall be prepared as necessary,
and shall be made based upon the limitation sample.

     2.4   Diameter and Tolerance (mm)

              Diameter( Φ)              Tolerance

                     20                    ±0.1

            1.6  1.2   1.0   0.8          ±0.05

          0.65       0.6     0.5                      However, the joint part

                 0.4    0.3               ±0.03       Shall not be applied.

3. Inspection Report
   A inspection shall be carried out on each production lot in terms of the following
   items (1) through (4), and the Inspection Report which result is mentioned shall
   be attached at the time of delivery, when requested by your company
  (1) Chemical composition of solder alloy
  (2) Flux content
  (3)Chlorine content in flux
  (4)Aqueous solution resistance

4. Packaging / Marking

   4.1 Packaging

Inpidual packaging : Coiled around spool, and shrinking package

      Outer packaging        : Carton

      Packing unit           : 10 pcs.