
Cree是碳化硅 (SiC) 和氮化镓 (GaN) 晶片及 RF 通信设备的供应商。典型应用包括
Cree RF 器件尤其适用于高功率通信,这得益于我们所使用的碳化硅 (SiC) 材料。
SiC 具备的固有优势使得宽带放大器能够用于 UHF、L 频段和 S 频段应用。这些特性包括
这些特点使得 GaN HEMT 成为多倍频程应用中功率 FET 的理想之选,可用于十倍频程带宽功率放大器。
深圳市立维创展科技有限公司与Cree原厂直接签约代理销售其全系列射频通信用元器件,可提供COC文件和原厂提供的一切技术与服务支持。一手货源,货期与价格独具优势。


Cree’s CGHV1J025D is a high-voltage, gallium-nitride (GaN) high-electron-mobility transistor (HEMT) on a silicon-carbide substrate, using a 0.25-μm gate-length fabrication process. This GaN-on-SiC product offers superior high-frequency, high-efficiency features. It is ideal for a variety of applications operating from 10 MHz to 18 GHz at 40 V with a high breakdown voltage.
Features
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CGHV1J025D
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1.0 | 03 Apr 2014 |
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Eutectic Die Attach Procedure
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A | 30 Apr 2012 |
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GaN HEMT Biasing Circuit with Temperature Compensation
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B | 07 Aug 2012 |
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Thermal Optimization of GaN HEMT Transistor Power Amplifiers Using New Self-heating Large-signal Model
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C | 30 Apr 2012 |
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Thermal Performance Guide for High Power SiC MESFET and GaN HEMT Transistors
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A | 30 Apr 2012 |
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RoHS Declaration: HEMT Chips
Product ecology |
RS4001112012 | 09 Nov 2012 |
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Sales Terms and Conditions
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CGHV1J025D S-parameters, VDS = 40 V, 120 mA
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CGHV1J025D S-parameters, VDS = 40 V, 240 mA
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A Review of GaN on SiC HEMTs and MMICs
by Raymond S. Pengelly, Simon M. Wood, James W. Milligan, Scott T. Sheppard, and William L. Pribble |
Design | 01 Jun 2012 |
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Application of Non Linear Models in a range of challenging GaN HEMT Power Amplifier Designs
by Raymond S. Pengelly, Brad Millon, Donald Farrell, Bill Pribble, and Simon Wood |
Design | 16 Jun 2008 |
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