IXA70R1200NA
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Features:
Extreme-light Punch-Through (XPT™) thin wafer technologyReduced thermal resistanceLow energy lossesFast switchingLow tail currentHigh power densitySquare Reverse Bias Safe Operating Areas (RBSOA) up to breakdown voltagesShort circuit capabilityPositive on-state voltage temperature coefficientOptional co-packed Sonic-FRD™ or HiPerFRED™ diodesInternational standard and proprietary high voltage packages'