1.General Description
The MT7620 router module includes an 802.11n MAC and baseband, a
2.4 GHz radio and FEM, a 580 MHz MIPS® 24K™ CPU core, a 5-port
10/100 switch and two RGMII.The MT7620 includes everything needed
to build an AP router from a single chip. The embedded high
performance CPU can process advanced applications effortlessly,
such as routing, security and VoIP. The MT7620 also includes a
selection of interfaces to support a variety of applications, such as a
USB port for accessing external storage.
FeaturesI
? Embedded MIPS24KEc (580 MHz) with 64 KB I-Cache and 32 KB
D-Cache
? 2T2R 2.4 GHz with 300 Mbps PHY data rate
? Legacy 802.11b/g and HT 802.11n modes
? 20/40 MHz channel bandwidth
? Legacy 802.11b/g and HT 802.11n modes
? Reverse Data Grant (RDG)
? Maximal Ratio Combining (MRC)
? Space Time Block Coding (STBC)
? 16-bit SDRAM up to 64 Mbytes
? 16-bit DDR1/2 up to 128/256 Mbytes (MT7620A)
? SPI, NAND Flash/SD-XC
? 1x USB 2.0, 1x PCIe host/device
? 1-port 10/100 SW and two RGMII
? An optimized PMU
? Green AP
? Intelligent Clock Scaling (exclusive)
? DDRII: ODT off, Self-refresh mode
? SDRAM: Pre-charge power down
? I2C, I2S, SPI, PCM, UART, JTAG, MDC, MDIO, GPIO
? Hardware NAT with IPv6 and 2 Gbps wired speed
? 16 Multiple BSSID
? WEP64/128, TKIP, AES, WPA, WPA2, WAPI
? QoS: WMM, WMM-PS
? WPS: PBC, PIN
? Voice Enterprise: 802.11k+r
? AP Firmware: Linux 2.6 SDK, eCOS with IPv6
? RGMII iNIC Driver: Linux 2.4/2.6
Applications:
1.Routers 2.iNICs
3.NAS devices 4. Dual band concurrent routers
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2.General Specification
Model
UM7620NMT-V1.0
Product Name WLAN 11b/g/n
Major Chipset MT7620N
Standard IEEE802.11n 、IEEE 802.11g、IEEE 802.11b
Data Transfer Rate
1,2,5.5,6,11,12,18,22,24,30,36,48,54,60,90,120 and
maximum of 300Mbps
Frequency
Band
2.4GHz
Power Consumption 3.3 V ±10% I/O supply voltage
Dimension 41.0 x 28.0 x 3.0mm (LxWxH) +-0.2MM
Hardware Support
Flash:4M (W25Q32)
DDR:64M (5DS32M16)
Storage Conditions
The calculated shelf life in a sealed bag is 12 months if stored between 0 °C and 40
°C at less than 90% relative humidity (RH). After the bag is opened, devices that are
subjected to solder reflow or other high temperature processes must be handled in the
following manner:
Mounted within 168 hours of factory conditions, i.e. < 30 °C at 60% RH.
Storage humidity needs to maintained at < 10% RH.
Baking is necessary if the customer exposes the component to air for over 168
hrs, baking conditions: 125 for 8 hrs.
深圳市优迈德科技有限公司是专业从事信息技术、自动控制设备的技术开发、机电产品上门维护,电子元器件、智能控制产品、工业自动化控制工程、节能工程的设计与上门安装。产品应用领域涉及WIFI模组类、无线AP类 、RF无线模组类、Dongle类、3G,智能家居,工控行业控制器,我们有最好的产品和专业的销售和技术团队,公司发展迅速,我们为客户提供最好的产品、良好的技术支持、健全的售后服务。
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