电气特性 | (Tj=25℃) |
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参数 |
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| 描述 |
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| Min. | Typ. |
| Max. | Unit |
| Test Condition |
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V(BR)DSS |
| 漏源击穿电压 | 650 | — |
| — | V |
| VGS =0V, ID =250µA |
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RDS(ON) |
| 静态漏源 | — | 0.75 |
| 0.85 | Ω | VGS =10V, ID =5.0A** |
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VGS(th) |
| 栅极阈值电压 |
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| 2 | — |
| 4 | V |
| VDS=VGS, ID =250μA |
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IDSS |
| 漏电流源 | — | — |
| 1 | μA |
| VDS =650V, VGS =0V |
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IGSS |
| 门体漏电流 |
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| — | — |
| ±100 | nA |
| VDS =0V, VGS =±30V |
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TJ, TSTG |
| 操作和储存温度范围 |
| -55℃ to 150℃ Max |
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力学数据 |
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核心面积； |
| 3.993 ×5.058 |
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| mm2 |
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| 切屑图 |
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门垫大小 |
| 0.31 × 0.52 |
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| (排除划线) |
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隶线尺寸 | 100 |
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晶圆diameter |
| 100 |
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晶圆厚度 | 230 |
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平焊位置； |
| 90 |
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粗略估计 |
| 430 |
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源金属化 |
| Al, Si,Cu |
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排水金属化 |
| V, Ni, Ag |
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推荐d |
| 储存在原始容器中，在干燥的氮气中, |
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贮存环境 | <在23℃±3℃常温6个月 > |
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* 电气特性的报告参考包装的一部分（220）并不能保证模具的销售形式。客户包装材料的变化，尺寸和工艺可能AF参数性能的影响.
* F／T的RDS（ON）是一个估计值的赤裸的死，实际结果将取决于客户的包装材料和尺寸.
