参数配置：三合一卡座（SD&MMC&MS） 1.MATERIAL Insulator:High Temperature Thermoplastic, UL94V-O Contact:Copper Alloy Shell:Copper Alloy 2.PLATING Contact Area:Gold PLATED Over Ni. Solder Tail:Sn PLATED Over Ni. Shell Solder Arda:Gold PLATED Over Ni. 3.ELECTRICAL Operating Temperature:-25℃ TO+90℃ Current Rating:0.5mA max. Contact Resistance:100mΩ max. Insulation Resistance:1000MΩ min./500VDC
