SOFNG 2017 SIM-023 27.4mm*18.85mm*1.9mm卡座
SIM-023
27.4mm*18.85mm*1.9mm
外形尺寸:27.4mm*18.85mm*1.9mm |
参数配置:Push-Push 1.MATERIAL Insulator:High Temperature Thermoplastic, UL94V-O Contact:Copper Alloy Shell:Copper Alloy 2.PLATING Contact Area:Gold PLATED Over Ni. Solder Tail:Sn PLATED Over Ni. Shell Solder Arda:Gold PLATED Over Ni. 3.ELECTRICAL Operating Temperature:-25℃ TO+90℃ Current Rating:0.5mA max. Contact Resistance:100mΩ max. Insulation Resistance:1000MΩ min./500VDC |

