设备功能及应用简介：
该设备用于芯片封装前的芯片背胶工序，可将各种规格的IC模块进行热熔胶备胶加工。本机由PLC程序自动控制，运行稳定，人机界面显示及操作，参数方便可调。
功能特点：
1.该设备用于将各种规格的IC模块进行热熔胶备胶加工。
2.本机采用PLC 程序自动控制，大屏幕友好人机界面操作，各项参数方便可调，机器操作简单，维修方便。
3.模块步进由伺服控制，拉动距离直接调整参数，准确的光电传感器监控，使模块有了双重保护。
4.集IC模块条带和热熔胶条带的输送、冲胶、热焊备胶及成品条带收集于一体。
5.专业设计6脚IC和8脚IC背胶转换，不用更换模具，在人机界面上选择即可实现，无需调节机器。
技术参数：
1.外形尺寸：L1700×W520×H1650mm;
2.重 量：约300 Kg;
3.电 源：AC220V 50/60 Hz;
4.额定功率：约1.5KW;
5.控制方式：PLC+触摸屏控制；
6.工作速度: 11000粒~15000粒/小时;
LDT-BJ-1000
Auto Glue Tape lamination Machine
Function:
Glue tape lamination machine,automatic punching and cutting hot melt adhesive tape,to carry on the glue on the different models of the module.Adopting PLC program automatic control, large operation interface, running stable and the parameter is adjustable.
Features:
1.Automatic punching and cutting hot melt adhesive tape,to carry on the glue on the different models of the module.
2.Adopting PLC program automatic control, large operation interface, running stable and the parameter is adjustable,easy to operation and convenient to maintenance.
3.Module stepping controlled by servo system to keep the pulling distance be adjusted by parameter directly. The exact photoelectric sensor monitoring makes the module in double protection.
4.Incorporating the functions of IC module stripe and hot melt glue convey, rush glue, hot welding glue laminating and finished module stripe collecting.
5.Professional design, can realize the changing of 6 pin and 8 pin IC module glue tape lamination flexibility, without changing the mold.The selection can be achieved at the operation interface, without the need to adjust the machine.
Machine Spec:
1. Dimension: L1700 × W520 × H1650 mm
2. Weight：Around 300 KG
3. Power Source：AC220V 50/60HZ
4. Power: About 1.5 KW
5.Control Mode：PLC + Touch screen
6. Speed：11000～15000 grains/hour
