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ZAPO品牌模块 捷博科技我们的优势:
1、技术支持。公司拥有资深的工程团队,对射频通讯技术应用领域具有极深的造诣及理解,我们保证每一款产品都经过工程严格的网络通讯性能测试及电磁兼容性验证。大客户更享有瑞昱(Realtek)芯片原厂技术支持。
2、低成本。本模块采用Realtek的WIFI方案,供货稳定,批量价格很优惠。
3、各种版本的软件支持。我们为客户免费提供模块相关驱动升级等。
4、供货能力强。长期稳定批量供货无忧,小批量可当日交货。
5、性能稳定。我们的WIFI模块在上市前都经过芯片原厂验证许可,才敢推向市场,本产品性能稳定,目前正批量出货中。
6、FCC/CE认证。模组可以完全通过FCC、CE等电磁兼容认证(部分需付费)及RoHS,REACH环保指令。
7、已拥有客户领域。笔记型电脑、平板电脑、智能手机/电视、网络播放器、安防监控、智能家居等,为客户提供产品解决方案。
Product Specification
Project Name | 802.11a/b/g/n/ac 2T2R WIFI Module |
Model NO | W21 (USB2.0 Interface) |
Customer |
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Customer’s Part NO |
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Approved: | Check: | Draft: |
Feedback of customer’s Confirmation
We accept the specification after Confirmed. | ||
Customer | Customer signature | Approved Date |
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CONTENTS
0REVESION HISTORY3
0.1 MODEL NO DEFINITION3
1INTRODUCTIONS4
1.1OVERVEIW4
1.2SPECIFICATION REFERENCE4
2GENERAL SPECIFICATION5
2.1WIFI SPECIFICATION5
2.2POWER CONSUMPTION6
3MECHANICAL SPECIFICATION7
3.1OUTLINE DRAWING7
3.2CONNECTOR PIN DIFINITION8
3.3 TYPIC APPLICATION CIRCUIT9
4ENVIRONMENT REQUIREMENT9
4.1OPERATING & STORAGE CONDITIONS9
4.2RECOMMENDED REFLOW PROFILE10
4.3 NOTICE10
5PACKAGE10
0. Revision History
REV NO | Date | Modifications | Approved | Draft |
Rev1.0 | Mar.5 2015 | The First Released |
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Rev1.1 | Mar.24 2015 | Update the outline drawing |
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0.1 MODEL NO DIFINITION
EXAMPLE: F12ASUM13-W1
F 12A S U M 1 3-W 1 |
1. Introduction
W21 is a highly integrated single-chip MIMO (Multiple In, Multiple Out) Wireless LAN(WLAN) USB2.0 network interface controller complying with the wireless very high throughput IEEE 802.11ac Draft 2.0 and 802.11n specifications. The RTL8812AU provides a complete solution for a high-performance wireless client and also supports WIFI Direct feature that can easily build a WIFI P2P PAN network.
1.1 Overview
The general hardware for the module is shown in Figure 1. This WLAN Module design is based on Realtek RTL8812AU. It is a highly integrated single-chip MIMO Wireless LAN (WLAN) USB2.0 network interface controller complying with the 802.11a/b/g/n/ac specification. It combines a MAC, a 2T2R capable baseband, support 2.4G & 5G band, and RF in a single chip. It is designed to provide excellent performance and enhance the advantages of robust system and cost-effective.
1.2 SPECIFICATION REFERENCE
This specification is based on additional references listed as below.
iEEE 802.11a
iEEE 802.11b
iEEE 802.11g
iEEE 802.11n
iEEE 802.11ac
iEEE 802.11e(WMM)、
iEEE 802.11i(WPA,WPA2)
iEEE 802.11hTPC
iEEE 802.11k、WAPI
2. GENERAL SPECIFICATION
2.1 WiFi Specifications
Features | Descriptions | |
Main Chipset | Realtek RTL8812AU-VS-CG | |
Operating Frequency | 2.4G: 2.4000GHz~2.4835GHz 5G: 5.150GHz~5.825GHz | |
Host Interface | USB2.0 | |
WIFI Standard | iEEE802.11a/b/g/n/ac 2T2R | |
2.4G/5G At the same time work | Nonsupport | |
Modulation | 802.11b: CCK(11, 5.5Mbps), QPSK(2Mbps), BPSK(1Mbps) 802.11 a/g: OFDM 802.11n: MCS0-7 802.11ac: MCS0-9 | |
PHY Data rates | 802.11a: 54,48,36,24,18,12,9,6 Mbps 802.11b: 11,5.5,2,1 Mbps 802.11g: 54,48,36,24,18,12,9,6 Mbps 802.11n: 6.5~300Mbps 802.11ac: up to 866.7Mbps | |
Transmit Output Power | 802.11b@11Mbps 16±2dBm 802.11g@54Mbps 14±2dBm 802.11n@65Mbps 13±2dBm (MCS 0_HT20) 13±2dBm (MCS 7_HT20) 13±2dBm (MCS 0_HT40) 13±2dBm (MCS 7_HT40) 802.11a@54Mbps 14±2dBm 802.11ac@MCS9 13±2dBm | |
EVM | 802.11b /11Mbps : EVM≦-9dB 802.11a/g /54Mbps : EVM≦-25dB 802.11n /MCS7 : EVM≦-28dB 802.11ac /MCS9 : EVM≦-32dB | |
Receiver Sensitivity Bandwidth: 20MHz | 802.11b@8% PER 1Mbps≤ -88dBm 2Mbps≤ -87dBm 5.5Mbps≤ -85dBm 11Mbps≤ -82dBm | |
802.11g@10% PER 6Mbps≤ -86dBm 9Mbps≤ -85dBm 12Mbps≤ -84dBm 18Mbps≤ -82dBm 24Mbps≤ -80dBm 36Mbps≤ -77dBm 48Mbps≤ -73dBm 54Mbps≤ -71dBm | 802.11a@10% PER 6Mbps≤ -86dBm 9Mbps≤ -85dBm 12Mbps≤ -84dBm 18Mbps≤ -82dBm 24Mbps≤ -80dBm 36Mbps≤ -77dBm 48Mbps≤ -73dBm 54Mbps≤ -71dBm | |
802.11n 2.4G @10% PER MCS 0≤ -83dBm MCS 1≤ -82dBm MCS 2≤ -80dBm MCS 3≤ -78dBm MCS 4≤ -75dBm MCS 5≤ -71dBm MCS 6≤ -69dBm MCS 7≤ -67dBm | 802.11n 5G @10% PER MCS 0≤ -83dBm MCS 1≤ -82dBm MCS 2≤ -80dBm MCS 3≤ -78dBm MCS 4≤ -75dBm MCS 5≤ -71dBm MCS 6≤ -69dBm MCS 7≤ -67dBm | |
Receiver Sensitivity Bandwidth: 40MHz | 802.11n 2.4G @10% PER MCS 0 ≤-80dBm MCS 1 ≤-79dBm MCS 2 ≤-77dBm MCS 3 ≤-75dBm MCS 4 ≤-72dBm MCS 5 ≤-68dBm MCS 6 ≤-66dBm MCS 7 ≤-64dBm | 802.11n 5G @10% PER MCS 0 ≤-80dBm MCS 1 ≤-79dBm MCS 2 ≤-77dBm MCS 3 ≤-75dBm MCS 4 ≤-72dBm MCS 5 ≤-68dBm MCS 6 ≤-66dBm MCS 7 ≤-64dBm |
Receiver Sensitivity Bandwidth: 80MHz | 802.11ac 5G @10% PER MCS 0 ≤-76dBm MCS 1 ≤-73dBm MCS 2 ≤-71dBm MCS 3 ≤-68dBm MCS 4 ≤-64dBm MCS 5 ≤-60dBm MCS 6 ≤-59dBm MCS 7 ≤-58dBm MCS 8 ≤-53dBm MCS 9 ≤-51dBm |
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RF Antenna | External Antenna | |
OS Support | Android / Win CE /iOS /Linux/Windows 2000/XP/WIN7 | |
Security | WEP,TKIP,AES,WPA,WPA2 | |
Dimension | Typical L27.0*W20.0*T3.5mm (Without PIN header) |
2.2 Power Consumption
Test Environment:Win XP SP3、Voltage:3.3V
Mode | Current (mA) | |
2.4G | LINK | 170 |
Tx (CCK 11M) | 330 | |
Tx (OFDM 54M) | 180 | |
Tx (MCS7 20M) | 200 | |
Tx (MCS7 40M) | 180 | |
Rx | 170 | |
5 G | LINK | 220 |
80M MCS0 | 400 | |
80M MCS9 | 270 | |
40M MCS0 | 550 | |
40M MCS15 | 320 | |
20M MCS0 | 440 | |
20M MCS15 | 340 | |
Disable | 30 |
3. Mechanical Specification
3.1 Outline Drawing
(Top View)
3.2 Connector Pin Definition
Pin # | Name | Description |
1 | PB-P2 | WPS Switch (high potential) |
2 | GND | Ground |
3 | DP | USB Data + |
4 | DM | USB Data - |
5 | 3.3VCC | 3.3V Power Supply |
6 | LED | External LED control |
3.3 Typical application circuit
4. Environmental Requirements
4.1 Operating& Storage Conditions
Operating | Temperature: 0°C to +70°C |
Relative Humidity: 10-90% (non-condensing) | |
Storage | Temperature: -40°C to +80°C (non-operating) |
Relative Humidity: 5-90% (non-condensing) | |
MTBF (Mean Time Between Failures) | Over 150,000hours |
4.2 Recommended Reflow Profile
Referred to IPC/JEDEC standard.
Peak Temperature : <250°C
Number of Times : ≤2 times
4.3 Patch WIFI modules installed before the notice:
WIFI module installed note:
1. Please press 1 : 1 and then expand outward proportion to 0.7 mm, 0.12 mm thickness When open a stencil
2. Take and use the WIFI module, please insure the electrostatic protective measures.
3. Reflow soldering temperature should be according to the customer the main size of the products, such as the temperature set at 250 + 5 ℃ for the MID motherboard.
About the module packaging, storage and use of matters needing attention are as follows:
1. The module of the reel and storage life of vacuum packing: 1). Shelf life: 8 months, storage environment conditions: temperature in: < 40 ℃, relative humidity: < 90%RH.
2. The module vacuum packing once opened, time limit of the assembly:
1) check the humidity display value should be less than 30% (in blue), such as: 30% ~ 40% (pink), or greater than 40% (red) the module have been moisture absorption.
2) factory environmental temperature humidity control: ≦ -30 ℃, ≦ 60% RH.
3) Once opened, the workshop the preservation of life for 168 hours.
3. Once opened, such as when not used up within 168 hours:
1) The module must be again to remove the module moisture absorption.
2) The baking temperature: 125 ℃, 8 hours.
3) After baking, put the right amount of desiccant to seal packages.
5. Package
TBD...