（周期：55ms）

适用于2121,3014及2835,5050等

一、机型特性

1.采用国际的双固晶，双点胶，双晶片搜寻系统；

2.采用直驱电机驱动邦头；

3.采用线性电机驱动搜寻晶片平台（X/Y）与送料平台（B/C）

4.晶框采用自动角度修正系统；

5.采用可程式恒温点胶系统；

6.采用真空漏晶检测；

7.采用自动式装卸晶环系统、支架采用叠片式上料（免装料盒），有效提高了生产效率；

8.工控机控制设备运行，简化了自动化设备的操作；

9.精准的自动化设备为企业提高生产效率，降低成本提供了有效保障，从而切实有效地提高了企业竞争力；

10.精准的固晶位置及优良的一致性为后道工序提供了先天的保障。

GS100A

Plane-type High-speed Die Bonder

Cycle: 55ms

It is compatible with 2121、3014、2835 and 5050 etc.

Product Features

1.      International leading double die bond, double adhesive dispense and double die searching system;

2.      Linear motor is applied to drive bond head;

3.      Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);

4.      Automatic chip theta alignment system is applied on the Crystal frame;

5.      Programmed control constant-temperature adhesive dispensing system is also applied;

6.      Vacuum die missing testing technology is adopted;

7.      Automatic installing & uninstalling crystal rings and stacking holders for loading (free-loading magazine) is applied to improve the production efficiency largely;

8.      IPC will control the operation of equipment, simplifying the operation of automation equipment;

9.      Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;

10.  Precise die bond location and excellent compatibility will guarantee the back-end processing.

二、规格参数

Specifications and Parameters