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特點
◆ PC基板程序
◆ GUI (Graphic User Interface)
◆ 简单操作
◆ 使用者便利的系统
◆ 较高的准确性
◆ 通过Vision Camera的自动排列功能
◆ Dicing saw 是切割機為使用切割刀片針對矽・玻璃・陶瓷等被加工物進行高精度切割的裝置。
半自動切割機為被加工物的安裝及卸載作業均採用手動方式進行、僅有加工工序實施自動化操作
應用領域
◆ LED
◆ PCB
◆ Glass
◆ Silicon wafer
產品規格
Model | Unit | ADS-200 |
Max. workpiece size | mm | Ø200 |
X-axis | Usable stroke | mm | 200 |
Cut speed | mm | 0.1~400 |
Y-axis | Usable Stroke | mm/sec | 210 |
Resolution | mm | 0.0001 |
Indexing accuracy | mm | 0.002 |
(Single pitch) | mm |
Indexing accuracy | mm | 0.005/210 |
(Cumulative pitch) | mm |
indexong Step | mm | 0.0001 |
Z-axis | Usable stroke | mm | 40 |
(For 2"blade) | mm |
Resolution | mm | 0.0001 |
Repeating accuracy | mm | 0.001 |
Blade size | mm | 52 or 76.2 |
θ-axis | Rotation angle | Deg. | 100 or 380(Option) |
Spindle | Power | kW | 2.2 |
RPM | rpm | 50,000 |
Vision Unit | Manual or Auto(Option) alignment system |
Dimension(W*D*H) | 750*975*1600 |
Weight | 950 |
中国代理公司Beijing TSD Equipment Co., Ltd.
Floor No.1, No.1 Shunqiang Road, Shunyi
District,
Beijing China 101300
86-10-6477 8430
86-10-6477 8420