琳得科晶圆切割膜 晶片切割UV膜 玻璃切割UV膜 LINTEC琳得科UV膜 UV胶带 玻璃/晶圆切割 ADWILL D系列 膜
一．详细说明Features:
1.保护膜以特殊聚乙烯(PE)塑料薄膜为基材,以交联型丙烯酸树酯作胶粘剂,再经过几种特殊助剂加工而成.性质柔软,粘着性能好,容易粘贴,容易剥离,剥离无残胶.
2.保护膜的型号和粘度需根据客户的不同需求进行选择
二．规格介绍specification
(1)保护膜的厚度：0.02mm-0.15mm
(2)颜色：透明，蓝色，黑色，乳白色，黑底白面色，银灰色，
特殊颜色可根据客户定制
(3)宽度：1650mm以内，长度在1000M以内各种规格都可生产。陶瓷长用规格(600MM-800MM)
(4)粘度：中粘，高粘
三、技术性能
本产品的特点是牢而不固，对于各种基材表面都粘得牢，而当工艺过程结束将其揭下来时，不会有胶质残留，也不会产生腐蚀作用。
1、温度特性：常温
2、耐潮湿性：在相对湿度为95%的环境中，可以长期储存和使用。
3、耐老化性：本产品耐老化周期为6个月。
一、主要用途
1、保护作用：将本产品贴敷于各种制品的表面上，可以有效地起到保护作用，使其在储藏、运输和加工过程中不被弄脏和划伤。本产品适用于各种家用电器、数码产品、铝合金制品、不锈钢制品、有机玻璃制品、***家具、还有漆面板、镜面板、合金面板以及各种高级装饰面板，各种建筑板材等。
2、遮蔽作用：各种制品，当其表面需要喷涂、酸蚀等深加工的时候，其不需要喷涂、酸蚀的表面需要遮蔽起来，当进行多种颜色喷遮的时候，遮蔽作用就更加重要。使用本产品做遮蔽用，是您的选择。
我公司代理琳得科ADWILL D系列UV膜，用于玻璃，晶圆，基板，陶瓷片等产品的切割。价格优势，欢迎来电咨询。
Two types of back grinding tape are available. The "E series" which can be removed without placing stress on the wafer by decreasing adhesion by UV irradiation, and the "P series" which is non-UV type. In addition, there is the "S series" peeling tape.
Product Information
Si Wafer
Base Material:PVC-PO | High Expandability Antistatic Anti-chipping High Adhesion Easy Pick Up
|
Glass / Ceramics
Base Material:PVC-PET | |
Package Substrate
Base Material:PO | |
Stealth Dicing
Base Material:PVC-PO | |
Wafer with LC Tape
Base Material:PO | |
Adwill D series is an epoch-making line of UV curable dicing tapes whose features can be changed in accordance with operational process. The tape&＃39;s strong adhesion secures wafers during dicing, and then is reduced by UV irradiation to facilitate pick-up. This dicing tape is essential for full-cut dicing of wafers to improve die quality, and fully applicable to dies of multiple sizes.
Secures wafers with strong initial adhesion to ensure dicing without any slipping or peeling even for small dies.
Supports instant control of adhesion by UV irradiation, allowing large dies to be picked up easily.
Causes no contamination by metal ions or by adhesive residue on the wafer backside surface, and no adverse UV irradiation effects on ICs.
Prevents contact damage of dies with superb expandability, which is not reduced by UV irradiation.
Offers a variety of tape grades ranging from a tape with reduced tape chips at high speed, full-cut dicing to a special tape for thin wafers.
Provides special grades not only for wafer dicing but also for package, ceramic or glass dicing.
Provides various not only for blade dicing but also for laser dicing.
Supports the adhesive coating process environment that meets Class 100 (ANSI 209b) standards.
