本产品适用于各种FPC、FFC、COF、TAB、HSC与LCD及PCB邦定。
Application:
The machine is used for bonding FPC, FFC, COF, TAB, HSC to various LCD panels and PCB.
工艺应用：TAB、FOB、FOG
Technic Application: TAB, FOB, FOG
功能特点：
Key Feature:
■ SUNSOM压力系统双缸结构可消除压头自重，压力最小精度可达0.1KG
Double cylinders of SUNSOM pressure system can eliminate self-gravity of bond head. Minimum pressure accuracy is 0.1kg.
■ 4套C/L高倍清晰视觉系统使产品对位更精准、直观
Four sets C/L high clearance vision system make the alignment correctly and intuitively.
■ SUNSOM 压头结构采用2组精密级滑轨主定位，直线轴承辅助定位，精密可达±5um
SUNSOM bond head structure adopt two precise slide rail position, linear bearing assit position, and accuracy is ±5um.
■ 内置真空及自动式卷皮配置
Build-in vacuum and auto rolling device.
■ 配套日本温控系统、操作系统及7寸人机界面
Japanese temperature controlling system, operating system and 7" human-machine interface.
