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锡膏S70G环保系列Senju下一代粘贴基于五年以上的高
批量生产经验和行业标准GRN360无铅锡膏产品。S70G
已经被设计来进一步提高产品质量和提高生产率为所有SMT焊接程序。
其中型铅锌矿床焊锡膏资料以助焊剂,不含
卤素(溴、Cl)。卤、溴或Cl数量的流量测量焊渣烧瓶燃烧
型为EN14582卤素定量试验表明,它是900ppm低于全球
环境考量型产品。
ECO Solder Paste S70G Series is Senju’s next generation paste based on over 5 years of high
volume production experience with the industry standard GRN360 lead–free solder paste. S70G
has been designed to further improve quality and productivity for all SMT solder applications.
Among them HF type solder paste material is designed with the flux which does not contain
Halogen (Br,Cl). Halogen, Br or Cl amount in flux residue after reflow measured by flask combustion
type halogen quantitative test represented by EN14582 shows less than 900ppm and it is global
environmental consideration type products.
