用于电子元器件或其它的小型部件粘接在印刷电路板上的贴片红胶
深圳稼稼晨科技发展有限公司
中国 深圳
产品属性
图文详情
品牌推荐
品牌/型号
胜泰/T-5843
树脂胶分类
环氧树脂
粘合材料
电子元件
T-5843
Technical Data SheetONE COMPONENT EPOXY SURFACE MOUNT ADHESIVE单组分环氧树脂贴片胶 PRODUCT DESCRIPTION产品介绍T-5843surface mount adhesive is formulated to bond electrical devices or other small parts to printed circuit boards before wave soldering by syringe dispense Method. It has following features.T-5843 贴片胶用于注射器分配法的波峰焊之前将电子元器件或其它的小型部件粘接在印刷电路板上.它具有以下特性.l
High dispense speed高分配速度l
Excellent green/wet strength极佳的未固化/湿强度l
High dot profile高的点轮廓l
Good electrical properties好的电学性能l
Lead free application无铅化应用 PROPERTIES OF UNCURED MATERIAL固化前材料性能Property性能Test Method测试方法T-5843Color/Appearance颜色/外观VisualViscous Red Gel粘稠红色凝胶Specific Gravity密度, g/cc,ASTM D-7921.2Viscosity粘度,cone & Plate, Pa.sASTM D-2393~126(25°C);~115(30°C);~100 (35°C)Yield strength屈服强度,cone & Plate, Pa, 25°C 150-250 TYPICAL PROPERTIES OF CURED MATERIAL固化后材料典型物理性能Property性能Test Method 测试方法Value
数值Coefficient of thermal expansion热膨胀系数, CTEASTM D696100 E-06Thermal conductivity热导率, w/m-kASTM C1770.32Glass transition temperature玻璃化转变温度, Tg,°CASTM D4065115Lap shear strength搭接剪切强度, steel钢, Mpa > 16Torque strength扭转强度, FR4 PCB, N.mm 62Pull off strength拉离强度, FR4 PCB, N 55Volume resistivity体电阻系数, ohms-cmASTM D-2571.5 E 15Surface resistivity表面电阻系数, ohmsASTM D-25750 E 15Dielectric constant电介质常数ASTM D1502.9(1 kHz),
2.8(10 kHz)Hot solder dip @260°C热浸焊@260°C Pass通过Resistance to lead-free solder无铅焊接剂的抵抗性Alcohol / water based flux,260°Cdual wave水/酒精基焊剂,260°C双波峰焊接No component loss in the wave在波峰焊中无成分损失Surface Insulation Resistance, reliability/electrical bias表面绝缘抵抗性，可靠性/电偏压85°C/ 85% RH, 1000 hours85°C/ 85%相对湿度，1000小时Pass通过
DIRECTIONS FOR USE使用方法Typical curing condition典型固化条件:
90 ~ 120 secondsat 150 ºC在150 ºC下保持90 ~ 120秒 Curing starts above 100 ºC, with a DSC conversion of 90%, 4 min. at 125 ºC, 10min. at100ºC固化开始于100 ºC以上,在125 ºC保温4分钟,在100 ºC保温10分钟,热转换为90%. CLEANING清除Uncured adhesive can be easily removed from printed circuit boards using isopropyl alcohol(IPA) or MEK.未固化胶粘剂可被轻易从印刷电路板上用异丙醇或丁酮清除 STORAGEINFORMATION保存方法在5 ºC下密封干燥储存,保质期为6个月
Technical Data SheetONE COMPONENT EPOXY SURFACE MOUNT ADHESIVE单组分环氧树脂贴片胶 PRODUCT DESCRIPTION产品介绍T-5843surface mount adhesive is formulated to bond electrical devices or other small parts to printed circuit boards before wave soldering by syringe dispense Method. It has following features.T-5843 贴片胶用于注射器分配法的波峰焊之前将电子元器件或其它的小型部件粘接在印刷电路板上.它具有以下特性.l
High dispense speed高分配速度l
Excellent green/wet strength极佳的未固化/湿强度l
High dot profile高的点轮廓l
Good electrical properties好的电学性能l
Lead free application无铅化应用 PROPERTIES OF UNCURED MATERIAL固化前材料性能Property性能Test Method测试方法T-5843Color/Appearance颜色/外观VisualViscous Red Gel粘稠红色凝胶Specific Gravity密度, g/cc,ASTM D-7921.2Viscosity粘度,cone & Plate, Pa.sASTM D-2393~126(25°C);~115(30°C);~100 (35°C)Yield strength屈服强度,cone & Plate, Pa, 25°C 150-250 TYPICAL PROPERTIES OF CURED MATERIAL固化后材料典型物理性能Property性能Test Method 测试方法Value
数值Coefficient of thermal expansion热膨胀系数, CTEASTM D696100 E-06Thermal conductivity热导率, w/m-kASTM C1770.32Glass transition temperature玻璃化转变温度, Tg,°CASTM D4065115Lap shear strength搭接剪切强度, steel钢, Mpa > 16Torque strength扭转强度, FR4 PCB, N.mm 62Pull off strength拉离强度, FR4 PCB, N 55Volume resistivity体电阻系数, ohms-cmASTM D-2571.5 E 15Surface resistivity表面电阻系数, ohmsASTM D-25750 E 15Dielectric constant电介质常数ASTM D1502.9(1 kHz),
2.8(10 kHz)Hot solder dip @260°C热浸焊@260°C Pass通过Resistance to lead-free solder无铅焊接剂的抵抗性Alcohol / water based flux,260°Cdual wave水/酒精基焊剂,260°C双波峰焊接No component loss in the wave在波峰焊中无成分损失Surface Insulation Resistance, reliability/electrical bias表面绝缘抵抗性，可靠性/电偏压85°C/ 85% RH, 1000 hours85°C/ 85%相对湿度，1000小时Pass通过
DIRECTIONS FOR USE使用方法Typical curing condition典型固化条件:
90 ~ 120 secondsat 150 ºC在150 ºC下保持90 ~ 120秒 Curing starts above 100 ºC, with a DSC conversion of 90%, 4 min. at 125 ºC, 10min. at100ºC固化开始于100 ºC以上,在125 ºC保温4分钟,在100 ºC保温10分钟,热转换为90%. CLEANING清除Uncured adhesive can be easily removed from printed circuit boards using isopropyl alcohol(IPA) or MEK.未固化胶粘剂可被轻易从印刷电路板上用异丙醇或丁酮清除 STORAGEINFORMATION保存方法在5 ºC下密封干燥储存,保质期为6个月
