PRODUCT DESCRIPTION产品描述
G-6444A/Bis a low viscosity, two-part epoxy casting system. It provides users with excellent insulating properties. This product is featured with its ease of handling, room temperature cure capability. The cured product demonstrates excellent thermal shock, impact and good flexibility. It is suitable for the application such as filter circuits, modules, auto sensors, capacitors, iron-core transformers, magnetic heads, coils, etc. G-6444A/B是一种低粘度双组分环氧浇铸胶。该产品可给用户予绝佳的绝缘性能。此外，该产品具有操作简便，室温固化的优点。固化后该产品表现出优异的抗热冲击和机械冲击性能并具有很好的韧性。可广泛用于滤波电路，模块，汽车传感器，电容器，铁心变压器，磁头，线圈等。
PROPERTIES OF UNCURED MATERIAL固化前材料性能
Properties 性能 | Test Method 测试方法 | Resin-6444A 树脂-6444A | Hardener-6444B 固化剂-6444B | Mixed-A/B 混合物-A/B |
Color/Appearance 颜色/外观 | Visual 目测法 | transparentliquid无色液体 | transparent liquid无色液态 | transparent 无色透明 |
Specific Gravity 比重 | ASTM D-792 | 1.15-1.18 | 0.98 |
|
Viscosity @ 25°C, cps粘度（25°C） | ASTM D-2393 | 11,000-13,000 | 10 - 14 | 2500 -3000 |
Shelf life, 25°C, month保质期，月 |
| 12 | 12 |
|
TYPICAL CURED PROPERTIES固化后属性
Property性能 | Test Method测试方法 | value数值 |
Hardness (Shore D)硬度 | ASTM D-2240 | 86 |
Elongation at break断裂延伸率，% |
| 3 |
Tensile strength拉伸强度,psi |
| 9000 |
Glass transition temperature 玻璃化转变温度, Tg, ºC | DMA | 80 |
Thermal Conductivity导热率, W/M-K |
| 0.18 |
Max. service temperature最大工作温度, ºC |
| 120 |
Coefficient of thermal expansion 热膨胀系数, CTE | ASTM D3386 | 68 E-06 |
Water absorption吸水率,% weight |
| 0.15 |
Surface resistivity表面电阻, ohms |
| 2.8E14 |
Volume resistivity体积电阻率, ohms-cm |
| 3.0E16 |
Dielectric constant介电常数，1 kHz | ASTM D150 | 3.8 |
Dissipation factor耗散因子，Hz |
| 0.013 |
Dielectric strength, KV/mm,介电强度 | ASTM D149 | 60 |
CURING SCHEDULE固化步骤
Resin/Hardener Ratio (by weight) 树脂与固化剂重量比 | 100 / 12.5 |
Pot Life (200 gram mass), 25°C, minutes保质期（200g）25°C，分钟 | 60 |
CURING TIME TABLE固化进度表
Temperature温度 | Minimum Cure Time最少固化时间 |
25 ºC (77ºF) | 3 hours to handling strength 3小时到达操作强度 |
25 ºC (77ºF) | 24 hours 24小时to full strength |
60 ºC (158ºF) | 3 hours 3小时 |
SHELF METHOD保存方法
Store at 15 - 30 ºC in a dry place. After each use, tightly reseal.每次用完后，应密封保存于15 - 30 ºC的干燥处。
