技术参数：
材料 Material | 软性线路板 FPC 软软硬结合 Rigid---FlexPCB | 注解 测试方式 Remark＆Test method | |
层数 Layers | 1—10 2--10 |
| |
最小线宽线距Width/space | Single-sided 0.05mm(2mil) |
| |
Double-sided 0.05mm(2mil) |
| ||
尺寸公差 Dimension tolerance | 线宽 Line width | +/-0.03mm | W H P Specicl +/-0.07mm Specicl +/-0.075mm |
孔径hole | +/-0.02mm | ||
间距 Cumulate space | +/-0.05 | ||
外形outline | +/-0.1mm | ||
Confuctor to outline | +/-0.1mm | ||
最小孔径 Hole(min) | 钻孔Drill | 0.15mm |
|
冲孔Punching | 0.50mm | ||
表面工艺 Surface treament | 镀镍/镀金Ni/Au plating | Ni :2-8un(80uin-320uin) Au:0.05-0.125um(2uin-5uin) |
|
沉金电镍Electronic Nickle Immersion Gold(ENIG) | 镍Ni:3-5um(120uin-200uin) 金Au>=0.05nm(2uin) Or specified by Customer Bonding:Ni:2-6um Au>=0.2um(thick Au) | ||
镀锡 Tin Plating | 10-20um或者客户指定 10-20um or specified by customer | ||
表面抗拉强度 Peel strength | 胶粘剂Adhesive:1.0mil | 1.0kgf/cm 1.0kgf/cm | IPC-TM-6502.4.9 |
胶粘剂Adhesive:0.5mil | 0.5kgf/cm 0.5kgf/cm | ||
焊剂高温特性 Solder heat resistance | 300℃/10sec 300℃/10sec | IPC-TM-6502.4.3 | |
绝缘电阻Insulation Resistance | 500MΩ 500MΩ | IPC-TM-6502.6.3.2 | |
额定电压 Dielectric with standing voltage | 500V 500V | IPC-TM-6502.5.7 | |
化学抗性 Chemical Resistance | 无色变 No discoloration No discoloration | IPC-TM-6502.3.2 | |
热量变化Thermal block | 阻值变化不能超过+/-10%
| IPC-TM-6502.6.7.2 |
技术参数：
材料 Material | 软性线路板 FPC 软软硬结合 Rigid---FlexPCB | 注解 测试方式 Remark＆Test method | |
层数 Layers | 1—10 2--10 |
| |
最小线宽线距Width/space | Single-sided 0.05mm(2mil) |
| |
Double-sided 0.05mm(2mil) |
| ||
尺寸公差 Dimension tolerance | 线宽 Line width | +/-0.03mm | W H P Specicl +/-0.07mm Specicl +/-0.075mm |
孔径hole | +/-0.02mm | ||
间距 Cumulate space | +/-0.05 | ||
外形outline | +/-0.1mm | ||
Confuctor to outline | +/-0.1mm | ||
最小孔径 Hole(min) | 钻孔Drill | 0.15mm |
|
冲孔Punching | 0.50mm | ||
表面工艺 Surface treament | 镀镍/镀金Ni/Au plating | Ni :2-8un(80uin-320uin) Au:0.05-0.125um(2uin-5uin) |
|
沉金电镍Electronic Nickle Immersion Gold(ENIG) | 镍Ni:3-5um(120uin-200uin) 金Au>=0.05nm(2uin) Or specified by Customer Bonding:Ni:2-6um Au>=0.2um(thick Au) | ||
镀锡 Tin Plating | 10-20um或者客户指定 10-20um or specified by customer | ||
表面抗拉强度 Peel strength | 胶粘剂Adhesive:1.0mil | 1.0kgf/cm 1.0kgf/cm | IPC-TM-6502.4.9 |
胶粘剂Adhesive:0.5mil | 0.5kgf/cm 0.5kgf/cm | ||
焊剂高温特性 Solder heat resistance | 300℃/10sec 300℃/10sec | IPC-TM-6502.4.3 | |
绝缘电阻Insulation Resistance | 500MΩ 500MΩ | IPC-TM-6502.6.3.2 | |
额定电压 Dielectric with standing voltage | 500V 500V | IPC-TM-6502.5.7 | |
化学抗性 Chemical Resistance | 无色变 No discoloration No discoloration | IPC-TM-6502.3.2 | |
热量变化Thermal block | 阻值变化不能超过+/-10%
| IPC-TM-6502.6.7.2 |
技术参数：
材料 Material | 软性线路板 FPC 软软硬结合 Rigid---FlexPCB | 注解 测试方式 Remark＆Test method | |
层数 Layers | 1—10 2--10 |
| |
最小线宽线距Width/space | Single-sided 0.05mm(2mil) |
| |
Double-sided 0.05mm(2mil) |
| ||
尺寸公差 Dimension tolerance | 线宽 Line width | +/-0.03mm | W H P Specicl +/-0.07mm Specicl +/-0.075mm |
孔径hole | +/-0.02mm | ||
间距 Cumulate space | +/-0.05 | ||
外形outline | +/-0.1mm | ||
Confuctor to outline | +/-0.1mm | ||
最小孔径 Hole(min) | 钻孔Drill | 0.15mm |
|
冲孔Punching | 0.50mm | ||
表面工艺 Surface treament | 镀镍/镀金Ni/Au plating | Ni :2-8un(80uin-320uin) Au:0.05-0.125um(2uin-5uin) |
|
沉金电镍Electronic Nickle Immersion Gold(ENIG) | 镍Ni:3-5um(120uin-200uin) 金Au>=0.05nm(2uin) Or specified by Customer Bonding:Ni:2-6um Au>=0.2um(thick Au) | ||
镀锡 Tin Plating | 10-20um或者客户指定 10-20um or specified by customer | ||
表面抗拉强度 Peel strength | 胶粘剂Adhesive:1.0mil | 1.0kgf/cm 1.0kgf/cm | IPC-TM-6502.4.9 |
胶粘剂Adhesive:0.5mil | 0.5kgf/cm 0.5kgf/cm | ||
焊剂高温特性 Solder heat resistance | 300℃/10sec 300℃/10sec | IPC-TM-6502.4.3 | |
绝缘电阻Insulation Resistance | 500MΩ 500MΩ | IPC-TM-6502.6.3.2 | |
额定电压 Dielectric with standing voltage | 500V 500V | IPC-TM-6502.5.7 | |
化学抗性 Chemical Resistance | 无色变 No discoloration No discoloration | IPC-TM-6502.3.2 | |
热量变化Thermal block | 阻值变化不能超过+/-10%
| IPC-TM-6502.6.7.2 |
