产品特点

     可加工陶瓷（包括硬度极高的二氧化锆），石英，玻璃，金属，塑料等材料，采用中心加压式设计，并可根据加工要求任意设定研磨时间，自动记录研磨次数，可指导操作者根据研磨纸使用次数调整研磨时间，加压，卸载及更换夹具研磨片方便快捷，生产效率高（可数台并列成生产线），以不为研磨液，节省生产成本，高分子防水材料运用，确保电器和机箱密封防水。
  

Features
Designed for polish ceramic,quartz,glass,metal and plastic etc
Set pressure and time according to your require
Very expediedcy to load,unload and exchange polish films
Polishing quality is stability liquid,saving product cost
Water can be used as polishing liquid ,saving produce cost
Designed to adjust velocity and forward/reverse to insure polishing quality
Atmosphere/water and power supply are designed in respectively,to insure opreration is safety

 技术参数：                                                                                          

                    研磨底盘外径：112mm

                    机器净重：28kg

                    机器尺寸：450L*220W-500H

                    研磨时间设定：99分99秒（Max）

                    研磨底盘转速：15rpm-220rpm

                    研磨底盘跳动（径向及周向）：<10um

                    配重压力：2.1-3.6kg/cm(sq)

                    电源:AC220V,50Hz

Parameter
                     Polish pad OD:110
                     Net weights:28kg
                     Dimensions:450L*220W*500H
                     polish time setting:99m59S(Max.)
                     polishpad velocity:0rpm-180rpm
                     Loading pressure:2.1-3.6kgf/cm(sq)
                     Polish pad jumpiness:<10Um
                     Power supply:AC220V,50Hz