PA系列产品大量应用于粘接散热片到微处理器和其它的功率消耗半导体上,这些胶带具有的粘合强度,并且热阻抗小,可以有效的取代滑脂和机械固定.广泛应用于散热片上芯片的固定,可替代热熔胶,镙丝,扣具等固定方式。
Characteristics:The PA series product is entensively applied in microprocessor and other power consumption semiconductor. These tapes have adhesive strength and low impedance, so it can displace lubricating grease and mechanical fixation effectively. And also it can be widely used in the fixation of the chips on the cooling fins, displacing the thermo- cements, screws, buckles and so on.
