供应乐泰电子产品：Loctite胶粘剂、Hysol半导体和电子器件的封装材料、乐泰贴片红胶、乐泰导热胶、底部填充,Emerson&cuming和Ablestik导电胶及LED封装材料等.电话1.5.9.2.0.0.5.9.0.0.2陈先生 乐泰3220胶水LOCTITE 3220 is designed for use in heat sensitive devices. TYPICAL PROPERTIES OF UNCURED MATERIAL Casson Viscosity @ 25 °C, mPa?s (cP):Haake PK 100, M10/PK 1 2° ConeYield Point @ 25°C, MPaSpecific GravityPot Life @ 25oC, daysFlash Point - See MSDS TYPICAL CURING PERFORMANCE Cure Schedule5 to 10 minutes @ 80°C With all curing systems, the time required for cure depends on the rateof heating. Cure rate depends on the mass of material to be heatedand intimate contact with the heat source. Use suggested cureconditions as general guidelines. Other cure conditions may yieldsatisfactory results. 乐泰3513产品描述：　　乐泰3513是一种单组份环氧的可维修的底部填充树脂，适用于CSP（FBGA）以及BGA.加热后可快速固化。抗机械应力出色。低粘度树脂可充分的填充CSP和BGA的底部。汉高LOCTITE3513　　固化后材料的性能：　　固化前的材料特性：（100°C固化60分钟）　　典型值　　化学类型环氧树脂　　外观淡黄色液体　　比重＠25°C
1.15 乐泰3128是一款单组分，加热固化的环氧胶，该款产品可在低温下固化，并能在相对短的时间内对多数的基本材表现出优异的附着力.典型应用包括记忆卡，CCD/CMOS装配，尤其适合用于要求低温固化的热敏元器件 LOCTITE3128