应用：
焦磷酸铜主要用作焦磷酸电镀铜的主盐,是镀液中Cu2+的主要来源,JHD焦磷酸铜极低的金属杂质,以及无机杂质,其高品质无需经过任何处理就能直接使用,广泛应用于焦磷酸盐镀铜,镀青铜,镀镍铜锡合金以及镀镍钨合金等,同时也用于配制磷酸盐颜料,也适用装饰性保护层的铜底层和要求渗碳零件的局部防渗碳涂层.
产品特性及优势：
焦磷酸铜为淡绿色粉末状固体,溶于酸,不溶于水.可与焦磷酸钾形成水溶性的焦磷酸铜钾络盐,JHD生产的焦磷酸铜纯度高,超低的Fe,Pb,As含量,使产品更易被焦磷酸钾络合,镀液具优异的极化能力,电流分散能力,镀层均匀,晶体结构规则,镀液稳定,抗干扰能力强,维护简单.
Application:
Cupric pyrophosphate is used mainly as the main salt for copper pyrophosphate plating and is primary source of Cu2+in the plating solutions.JHD’s pyrophosphate copper contains very low metal and inorganic impurities. It can be used directly in the bath without any need for pre-treatment. They are widely used in copper plating, bronze plating, plating of nickel-plated copper-tin alloy and nickel-tungsten alloy etc. It is mainly uesd for the preparation of phosphate pigments, copper substrate protective layer of decorative ornaments and anticarburization coating.
Product features and benefits:
Cupric pyrophosphate is a light green powder. It is soluble in acid and not in water. Mixing with potassium pyrophosphate yields a water soluble potassium complex salt of copper-potassium pyrophosphate. It’s high purity enables easy complexing properties with potassium pyrophosphate. Plating solutions are extremely stable and is easy to maintain with excellent polarization and current dispersion abilities. Coatings are uniform, crystallization structure stable with strong anti-interference ability.
相对分子量(Molecular weight)：373.10外观(Appearance)：淡蓝色粉末(Light blue powder)CAS No：10102-90-6包装(Packaging)：20kg/包
主要的技术指标(Technical specifications)：
|
测试项目(Test items) |
规格(specifications) |
|
含量(Assayas Cu2P2O7•4H2O) |
≧99.0% |
|
含量(Assayas Cu) |
≧33.7% |
|
铁(Fe) |
≦0.01% |
|
铅(Pb) |
≦0.003% |
|
锌(Zn) |
≦0.005% |
|
镍(Ni) |
≦0.005% |
|
铬(Cr) |
≦0.0005% |
|
镉(Cd) |
≦0.0005% |
|
砷(As) |
≦0.003% |
|
硫酸盐(SO42-) |
≦0.1% |
|
氯化物(Cl-) |
≦0.01% |
|
酸不溶物(Insoubel in acid) |
≦0.1% |
