公司自主品牌ORION键合铜线经过多次配方升级，调整了线材微量金属含量，以改进线材的硬度以及线材与铝层的亲合度，大大减少了因铜材料的硬度能够导致的集成电路键合垫弹坑和键合垫开裂失效模式出现。“ORION”铜线采用KS相同制造工艺，在应用上可直接替用KS及贺力氏铜线而不需修改任何压焊参数，线材质量远高于目前国内的康强及韩国MKE的产品水平。在配合相应GAISER劈刀与工艺,已成功应用于多家集成电路封装厂1.0um薄铝层IC产品的大批量焊接封装，为集成电路、分立元器件、LED封装生产提供质量卓越的产品同时提供卓越的技术服务。。/欢迎各IC封装厂家及ＰＥ工程师来函资料（提供厂家名称，联系地址，索样人，职位及邮箱）索取样品以供测试验证。工艺技术咨询ＱＱ：９９５７４５９６０

Our own brand ORION bonding wire through a series of formula to upgrade, adjust the wire trace metal content, in order to improve wire hardness and wire and the aluminum layer affinity, significantly reduces the copper material hardness can lead to an integrated circuit bonding pad of the crater and the bonding pad cracking failure mode. This product has been successfully applied to a number of integrated circuit packaging plant1.0um thin aluminum layer IC products in large quantities of welding and packaging, integrated circuits, discrete components, LED packaging production with excellent quality products and provide excellent technical services.