无卤补强板 特征Propertie单位Unit标准Measured测试方法TestMethod剥离强度PeelStrength原始状态N/mm≥1.0 260ºC热冲击后≥1.0JIS C 6471 8.1.5200ºC干热处理后≥1.0 耐浸焊性Dip Soldering ResistanceºC300ºC*30sec/OKJIS C 6471
9.3树脂流动性Resin Flowµm≦100JIS C 6471 8.2吸水性Water Absorption%≦1.20IPC TM 650 2.6.2绝缘电阻InsulationResistanceW1.0×1010JIS C 6471 7.1无卤素Halogen Freeppm765Cl Br≤900ppm尺寸稳定性Dimension StabilityM.D%-0.4~0JIS C 6471 9.6T.D -0.2~0 介电常数 Mind electricityconstantΩ≥109IP-TM-650
2.6.3.消耗因素 Consume complication1MHZ≥4.0IPC-TM-650
2.5.5.耐燃性UL Flame Class等级Grade通过PassUL94V-0 File
