覆盖膜Coverlay Films聚酰亚胺覆盖膜由聚酰来胺薄膜涂覆胶粘剂并与离型膜或离型纸覆合而成，用於聚酰亚胺薄膜挠性印制电路板的表面保护，聚酰亚胺覆盖膜为聚酰亚胺覆铜板的配套产品，层压在聚酰亚胺覆铜板挠性印制电路板上，起表面绝缘、隔热保护、同时增强产品耐弯折强度等作用。Polyimide covering film to amines by Polyamide-coated adhesive film and with the release film or release paper together cover made of polyimide film for flexible printed circuit board surface protection, polyimide CCL polyimide covering film for the supporting products, laminated polyimide flexible copper clad laminate printed circuit boards, from the surface of insulation, heat protection, while enhancing the products resistance to bending strength and so on.产品特性Product Characteristic1.具有高抗剥离强度和优良的介电性能With a high anti-peel strength and excellent dielectric properties2.具有良好的尺寸穩定性能Has excellent dimensional stability properties of3.具有低流动性高粘接性High mobility with low adhesion of4.具有良好的耐化学性和耐溶剂特性Good chemical resistance and solvent resistance产品种类Product Category1.一般性覆盖膜Coverlay2.高Tg覆盖膜High Tg covering film3.无囟素高Tg覆盖膜Coverage of high-Tg halogen-freefilm\ 压合条件(供参考) Press Cond
层压
Laminated
温度 Temperature :
160ºC
压力 Pressure :
50kgf/cm2
时间 Time :
45minutes固化 Curing:
不需要nothing
快压 Fast pressure温度Temperature : 170ºC 压力Pressure : 40kgf/cm2时间 Time : 4minutes固化Curing: 160ºC×60min以上数据仅为代表值,非规格值。可按客户需求定制材料.The above data is only representative of the value of non-standard values。materials can be customized to their needs欢迎各界用户咨询合作！