Ceramic PCBmain technical parameters
Maximum measurement：114*114mm
Thickness：0.635~2.0mm
Dielectric constant：9.1（25℃/1MHz)
Copper foil thickness：0.01~0.2mm
Gold plating thickness：0.001~0.1mm
Plano concave depth：≤30uM
Compressive strength：7000~8000 N/C ㎡
Coefficient of thermal expansion: ppm/k:7.4(50℃~200℃)
Temperature Limit℃：-55~850(Inert gas）
Ceramic PCB dielectric power factor：≤3*10¯4（25℃/1MHz)
Ceramic PCB dielectric strength：14 KV/mm
Copper foil thermal conductivity：385 W/m.k
Surface roughness：Rp≤7 Rt≤30 Ra≤3 um