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2011年-2012年华为海思《最佳配套服务奖》
2011年 ARROW 最佳IDH合作伙伴
2011年 NXP 《最佳射频微波IDH》
2011年 锐能微《最佳合作伙伴》
2012年《国际电子商情》评为《最佳技术支持分销商》
2012年 《电子系统设计》评为《优秀IDH设计方案奖》
2012年《商界》评为《中国微创新企业100强》
2013年 福布斯中国潜力非上市公司100强--DXY鼎芯排名第五
详情请查看 www.dxytech.com www.ic365.cn QQ 1850507323
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Amp'ed RF 蓝牙模块超高性价比,国外的技术+国内的价格,性价比之王!!
Amp'ed 蓝牙模块应用领域有:
1、智能手表:计算心率、能耗,反馈到手表板
2、手指脉搏血氧仪
3、智能手表:通知手机消息
4、听筒:将用户的各项身体信号放大,让其更好呈现人体特性
5、高尔夫工具:将杆的操控位置、速度和回转呈现在手套上。
6、街机控制器:iPad与街机摇杆等联系起来,让用户随心所欲玩街机
7、直升机玩具:与iphone蓝牙相连,通过iphone控制
8、玩具车:由iphone操纵
9、OBD车载系统:改诊断仪将汽车的各项指标呈现出来
10、四轮校正仪:在4个轮上设置传感器,传感器把轮胎信息传回仪表。
11、打印机:
12、条形码检测仪
低功耗蓝牙模块, Class 1, Spec v3.0
Supporting the next generation Bluetooth, specification v3.0, the BT 31 delivers a multifunction solution in a ready to use module:
更多内容...
BT 31 Datasheet, BT Hardware Design Guide, abSerial Reference Guide, abSerial User Guide
BT 33微型蓝牙模块,内置天线, Class 2, Spec v3.0
Supporting the next generation Bluetooth, specification v3.0, the BT 33 delivers a multifunction solution in a ready to use module:
更多内容...
BT 33 Datasheet, BT Hardware Design Guide, abSerial Reference Guide, abSerial User Guide
BT 11百米蓝牙模块, Class 1, Spec v2.1 +EDR
With class 1 power of up to +17dBm, the BT 11 module has one of the best ranges in the industry.
The BT 11 module includes 16 general purpose input/output lines, several serial interface options, analog-to-digital inputs, and up to 2M bps data throughput.
The BT 11 is a surface mount PCB module that provides fully embedded, ready to use Bluetooth wireless technology. The reprogrammable flash memory contains embedded firmware for serial cable replacement using the Bluetooth SPP profile. Other popular Bluetooth profiles, such as OBEX, are also available.
Customized firmware for peripheral device interaction, power optimization, security, and other proprietary features may be supported and can be ordered pre-loaded and configured.
更多内容...
BT 11 Datasheet, BT Hardware Design Guide, abSerial Reference Guide, abSerial User Guide
BT 22微型蓝牙模块, Class 2, Spec v2.1 +EDR
Our micro-sized Bluetooth module is the smallest form factor available providing a complete RF platform. The BT 22 is designed for maximum performance in a minimal space and includes 4 general purpose and A/D IO lines, several serial interface options, and up to 2M bps data throughput.
The BT 22 is a surface mount PCB module that provides fully embedded, ready to use Bluetooth wireless technology. The reprogrammable flash memory contains embedded firmware for serial cable replacement using the Bluetooth SPP profile. Other popular Bluetooth profiles, such as OBEX, are also available.
Customized firmware for peripheral device interaction, power optimization, security, and other proprietary features may be supported and can be ordered pre-loaded and configured.
更多内容...
BT 22 Datasheet, BT Hardware Design Guide, abSerial Reference Guide, abSerial User Guide
BT 23微型蓝牙模块,内置天线, Class 2, Spec v2.1 +EDR
Our micro-sized Bluetooth module, with integrated antenna, is the smallest form factor available providing a complete RF platform. The BT 23 is designed for maximum performance in a minimal space and includes 6 general purpose and ADC/DAC IO lines, several serial interface options, and up to 2M bps data throughput.
The BT 23 is a surface mount PCB module that provides fully embedded, ready to use Bluetooth wireless technology. The reprogrammable flash memory contains embedded firmware for serial cable replacement using the Bluetooth SPP profile. Other popular Bluetooth profiles, such as OBEX, are also available.
Customized firmware for peripheral device interaction, power optimization, security, and other proprietary features may be supported and can be ordered pre-loaded and configured.
更多内容...
BT 23 Datasheet, BT Hardware Design Guide, abSerial Reference Guide, abSerial User Guide
BT 30HCI微型蓝牙模块, Class 1, Spec v3.0 +EDR
Amped RF Tech presents our BT30 HCI module, supporting Bluetooth specification v3.0. The BT30 is a low cost Bluetooth module for higher volume customers, and is intended to help customers shorten product development cycles and reduce cost. We offer a full upper layer stack Amped UP, which may be added to a customers host processor, and combined with the BT30, for a complete Bluetooth solution.