软板技术参数:材料 Material软性线路板FPC软软硬结合Rigid---FlexPCB注解测试方式Remark&Test method层数 Layers1—10 2--10
最小线宽线距Width/spaceSingle-sided 0.05mm(2mil)
Double-sided 0.05mm(2mil)
尺寸公差Dimensiontolerance线宽Line width /-0.03mmW<=0.15mmH<=1.5MMP<=10MMSpecicl /-0.07mmSpecicl /-0.075mm孔径hole /-0.02mm间距Cumulate space /-0.05外形outline /-0.1mmConfuctor to outline /-0.1mm最小孔径Hole(min)钻孔Drill0.15mm 冲孔Punching0.50mm
表面工艺Surface treament镀镍/镀金Ni/Au platingNi :2-8un(80uin-320uin)Au:0.05-0.125um(2uin-5uin) 沉金电镍Electronic Nickle Immersion Gold(ENIG)镍Ni:3-5um(120uin-200uin)金Au>=0.05nm(2uin)Or specified by CustomerBonding:Ni:2-6um Au>=0.2um(thick Au)镀锡Tin Plating10-20um或者客户指定10-20um or specified by customer表面抗拉强度Peel strength胶粘剂Adhesive:1.0mil1.0kgf/cm
1.0kgf/cmIPC-TM-6502.4.9胶粘剂Adhesive:0.5mil0.5kgf/cm
0.5kgf/cm焊剂高温特性Solder heat resistance300℃/10sec
300℃/10secIPC-TM-6502.4.3绝缘电阻Insulation Resistance500MΩ
500MΩIPC-TM-6502.6.3.2额定电压Dielectric with standing voltage500V
500V
IPC-TM-6502.5.7化学抗性Chemical Resistance无色变No discolorationNo discolorationIPC-TM-6502.3.2热量变化Thermal block阻值变化不能超过 /-10% IPC-TM-6502.6.7.2