FEATURE |
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XO/XI |
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■XO Typical 11.1*4.68*2.5 mm
standard footprint. |
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■XL Typical 11.1*4.68*3.51 mm
standard footprint. |
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■Low cost. |
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■Low profile for close PCB
stacking. |
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■Aging:±5ppm/year. |
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■Packing:Plastic bag 200/500 pcs or
Ammopack 1000 pcs(800 pcs). |
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XP/XJ |
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■XP Typical 13.0*4.85*3.15 mm metal
can SMD package. |
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■XJ Typical 13.0*4.85*4.2 mm metal
can SMD pcakage. |
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■24mm width Tape & Reel package
for automatic assembly. |
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■Aging:±5ppm/year. |
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■Packing:Tape & Reel,standard
1000 pcs per Reel. |
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EQULVALENT
SERLES RESISTANCE(ESR) |
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| ELECTRICAL SPECIFICATION |
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TYPE FREQUENCY | MODE | E.S.R |
| Storage
Temp.Range | -55℃~125℃ |
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Freq.≦4MHz | A1 | 140Ω |
| Drive Level | 10μW typical |
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4MHz﹤Freq.﹤5MHz | A1 | 120Ω |
| Shunt
Capacitance(Co) | 7.0pF Max. |
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5MHz≦Freq.﹤6MHz | A1 | 80Ω |
| Insulation
Resistance | 500MΩ Min.@ DC
100V |
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6MHz≦Freq.﹤7MHz | A1 | 70Ω |
| Aging | First year±5ppm Sub-year±5ppm |
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7MHz≦Freq.﹤9MHz | A1 | 45Ω |
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9MHz≦Freq.﹤13MHz | A1 | 40Ω |
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13MHz≦Freq.﹤16MHz | A1 | 35Ω |
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16MHz≦Freq.﹤20MHz | A1 | 30Ω |
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20.00MHz≦Freq.≦24MHz | A1 | 25Ω |
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24MHz≦Freq.﹤32MHz | A3 | 120Ω |
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32MHz≦Freq.≦80MHz | A3 | 80Ω |
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A1:AT cut
fundamental |
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A3:AT Third Overtone |
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FREQ.STABILITY
vs.LOAD CAPACITANCE |
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| FREQ.STABILITY
vs.TEMP.RANGE |
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Load Capacitance ppm | A:±5 | B:±10 | P:±15 | C:±20 | E:±30 |
| Temp.(℃) ppm | A:±5 | B:±10 | P:±15 | C:±20 |
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A | 8pF | × | × | △ | ○ | ○ |
| I | -10 to +60 | × | ○ | ○ | ○ |
C | 10pF | × | × | △ | ○ | ○ |
| C | -20 to +70 | × | △ | ○ | ○ |
D | 12pF | × | △ | ○ | ○ | ○ |
| L | -40 to +85 | × | × | × | ○ |
F | 16pF | × | △ | ○ | ○ | ○ |
| ○:Standard △:Available(case by
case) ×:Not available |
S | Series | △ | ○ | ○ | ○ | ○ |
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○:Standard △:Available(case by case) ×:Not available |
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