日本京瓷单组份，导热系数25W/mK，适合3-5W大功率LED和模组。自动点胶机适用。
- Introduction
Die Attach Paste ”KEMITITE CT285” is epoxy resin based and solvent free Type paste.
The highest thermal conductivity (25W/mK)
Good reflow performance due lower moisture absorption resin system.
CT285 is effectively used for power IC, transistor.
- Features
1） Good workability for dispensing due to solvent free and one liquid type paste.
2） Highest thermal conductivity(25W/mK)
3） Bleed less.
- General Property
Properties | Unit | Typical Value | Test Method | ||
Appearance | – | Silver Filled Paste | Visual | ||
Viscosity at 25C | Pa·s | 100 | EHD Viscometer 0.5rpm (3°cone) | ||
Thixotropic Index | – | 6.0 | 0.5rpm/2.5rpm | ||
Non Voletile | Wt% | 92.0 | 180C×2hr | ||
Silver Content | Wt% | 87.5 | 600C×3hr | ||
Adhesive Strength | 25C 300C | N | 30 20 | Frame: Cu/PPF Chip Size: 2×2mm | |
Volume Resistivity | Ohm.cm | 8×10-6 | Cure: 200C×90min Measurement: Room Temp | ||
Glass Transition Temperature | C | 200 | TMA | ||
Modulus(25C) | 25C | GPa | 16.5 | DMA | |
260C | 7.8 | ||||
CTE | Alpha 1 | Ppm | 75 | TMA | |
Alpha 2 | 200 | ||||
Ionic Impurity | Na | ppm | 6 1 | Atomic Absorption Ionchromatography | |
CI | |||||
Thermal Conductivity | W/m K | 25 | Laser Flash | ||
4. Standard Cure Condition
175C×60-90min
5. Remarks
Storage condition is _30 to _15C 6 month
CAUTION: Property values listed are typical values. The data herein is for information only.
