本公司产品芯片全部采用台湾进口超高亮大尺寸芯片，产品制造过程采用净化,抗静电的国际标准设施封闭作业
。拥有业内最先进的ASM全自动固晶、全自动焊线设备及全自动封胶设备，产品检测选用台湾多功能电脑
自动分光分色设备 处理
采用全自动化控制流程;1自动固晶 2自动焊线 3自动点荧光胶 4自动灌胶 5自动分光，分色.
■ Absolute Maximum Rating极限工作参数
Item 项目 | Symbol 代号 | Absolute Maximum Rating 极限工作参数 | Unit 单位 |
Forward Current 正向电流 | IF | 20 | mA |
Peak Forward Current 瞬间脉冲电流 | IFP | 50 | mA |
ReverseVoltage 反向电压 | VR | 5 | V |
Power Dissipation 消耗功率 | PD | 100 | mw |
Electrostatic discharge 静电释放 | ESD | 1000 | V |
Operation Temperature 工作温度范围 | TOPR | -40～+80 | ℃ |
Storage Temperature 存放温度范围 | TSTG | -40～+100 | ℃ |
Lead Soldering Temperature最高焊接温度 | TSOL | 230 ℃for 3sec Max。 | |
*Ifp Conditions: Pulse Wide≤10msec≤1/10
瞬间脉冲电流*Tsol Conditions:3mm from the base of epoxy bulb最高焊接温度 距胶体3mm
■ Typical Optical/Electrical Characteristics光电特性参数
Item 项目 | Symbol 代号 | Condition 测试条件 | Min 最小值 | Typ 典型值 | Max 最大值 | Unit 单位 |
Forward Voltage 正向电压 | VF | IF=20mA | 3.0 | 3.2 | 3.4 | V |
Reverse Current 逆向电流 | IR | VR=5V | 0 | 2 | 5 | uA |
Light intensity 光强度 | IV | IF=20mA | 1500 | 1800 | 2000 | mcd |
Viewing Angle 半光全角 | 2θ1/2 | IF=20mA | 60 | 90 | deg | |
Luminous Flux 光通量 | Φ | IF=20mA | 4 | / | 5 | lm |
Color Temperature 色温 | TC | IF=20mA | 6000 | 6200 | 6500 | K |
mend Forward Current 持续正向电流 | IF(rec) | IF=20mA | 20 | mA |
Notes:1.Work absolute ratings Ta=25℃工作常规值 温度=25℃2.Tolerance of measurement of forward voltage±0.1V正向电压误差范围±0.1V
■ Typical Optical/ Electrical Characteristics
3.Tolerance of measurement of peak Wavelength±2.0nm.
4.Tolerance of measurement of luminous intensity±15%.
5.Electrostatic sensitive device. When handling,please use anti-electrostatic gloves.
6. Please do not apply stress to the resin at high temperature.
7. Color bin grading is available for special applications.
Typical Electrical/Optical Characteristics Curve:(25℃Ambient TemperatureUnlessOtherwiseNoted)
Test Classification | Test Item | Test Conditions | Test Duration | Sample QTY | AC/RE |
Life Test | Room Temperature DC Operating Life Test | Ta=25℃±5℃，IF=20mA | 1000 hrs | 30pcs | 0/1 |
Environment Test | Thermal Shock Test | -10℃±5℃←→+100℃±5℃ 5min. 10sec. 5min. | 50 cycles | 30 pcs | 0/1 |
Temperature Cycle Test | -40℃±5℃←→25℃±5℃←→+85℃±5℃ 30min. 5min. 30min. | 50 cycles | 30 pcs | 0/1 | |
High Temperature＆ High Humidity Test | Ta=85℃±5℃ RH =85%±0.5 %RH | 1000 hrs | 30 pcs | 0/1 | |
High Temperature Storage | Ta=100℃±5℃ | 1000 hrs | 30 pcs | 0/1 | |
Low Temperature Storage | Ta=-55℃±5℃ | 1000 hrs | 30 pcs | 0/1 | |
Mechanical Test | Resistance to Soldering Heat | Ta=230℃±5℃ | 5sec. | 30 pcs | 0/1 |
Lens Integrity | Load 2.5N(0.25kgf) 0°~ 90°~0° | 3times | 30 pcs | 0/1 |
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