主要应用/Application
广泛应用于大功率的高频谐振设备中
Widely used in high power high frequency resonant device
产品特点/Characteristics
电介质:聚丙烯薄膜
结构:铝箔、金属化膜内串结构
封装:铜板
高电压、高频率、高dv/dt特性
能承受大电流,散热性能好
Dielectric:Polypropylene film
Structure: aluminum foil, metal film inner series structure
Package: Copper
High voltage, high frequency, high dv/dt characteristics
Can bear high current, good heat radiation performance
技术性能/Specifications
引用标准/Reference standards | GB/T 17702 IEC 61071 GB/T 12747 |
工作温度范围/Operating temperature range | -40℃~85℃ |
容量范围/Capacitance | 0.24μF~1.2μF |
容量偏差/Tolerance | ±5%±10% |
极间耐电压/Test voltage between terminals | 5.0Ur10s 25℃±5℃ |
极壳耐电压/Test voltage between terminals and case | 6000Vac或9000Vdc 50Hz 60s,25℃±5℃ |
损耗角正切/Dissipation factor | tgδ≤5×10-4 at 25℃±5℃,1kHz |
绝缘电阻/Insulation resistance | R≥200000MΩ,at 500Vdc,25℃±5℃,60s |
预期寿命/Life expectancy | 200000h at Ur and 70℃,30000h at Urms |
此产品关键字:高频高压谐振电容、谐振电路电容的功能、谐振电容的影响
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邮箱:hydl@hy-el.com hy@hy-el.com