·体积小，适合高密度表面贴装         ·Minature size, suitable for SMT; 

·采用端电极结构，很好地抑制了引      ·Using terminal electrode structure to restrain the

·线引起的寄生元件效应，具有高可       parasitic component effect quite caused by lead;

靠性                               ·Execellent in solderability and heat resistance;

·优良的焊接性和耐焊性               ·Best frequency special property and intense

·更好的频率特性和更强的抗干扰能力     ability to resist interference.