、表面工艺:喷锡、电镀镍/金、化学镍/金等、OSP膜等。
2、PCB层数Layer 1-20层
3、最大加工面积Max board sixc单面/双面板650x450mm Single/
4、板厚Board thickncss 0.3mm-3.2mm最小线宽Min track width 0.10mm最小线距Min.space 0.10mm
5、最小成品孔径Min Diameter for PTH hole 0.3mm
6、最小焊盘直径Min Diameter for pad or via 0.6mm
7、金属化孔孔径公差PTH Hole Dia.Tolerance ≤Ф0.8±0.05mm>Ф0.8 ±0.10mm
8、孔位差Hole Position Dcviation ±0.05mm
9、绝缘电阻Insuiation resistance>1014Ω(常态)
10、孔电阻Through Hole Resistance ≤300uΩ