华锦富年是Youkwire键合系列线材的华南地区总代理。Youkwire键合系列线材是河南优克电子有限公司依托兰州理工大学作为产品研发技术支持，配合华锦富年优质的产品服务技术支持，近年来，youkwire键合线材以良好的产品稳定性和优质的技术服务逐步占领市场。

HUAJINFUNIAN is Youkwire series of wire bonding agent in Southern China. Youkwire bonding wire series is Henan excellent electron Limited company based in Lanzhou University of Technology as the product development and technical support, combined with our quality products services and technical support, in recent years, youkwire bonding wire products with good stability and high quality technical services and gradually occupied the market.

1） 单晶粒：相对目前的普通铜材（多晶粒），而单晶铜丝只有一个晶粒，内部无晶界。而单晶铜杆有致密的定向凝固组织，消除了横向晶界，很少有缩孔、气孔等铸造缺陷；且结晶方向拉丝方向相同，能承受更大的塑性变形能力。此外，单晶铜丝没有阻碍位错滑移的晶界，变形、冷作、硬化回复快，所以是拉制键合引线（￠0.03-0.016mm）的理想材料。

Single grained: relative to the current ordinary copper ( grain ), and single crystal copper wire only one grain, no internal grain boundaries. The single crystal copper rods have dense directional solidification microstructure, eliminating lateral boundary, there are few shrinkage porosity, casting defects such as crystallization direction; and drawing the same direction, can bear larger plastic deformation capacity. In addition, single-crystal copper did not hinder dislocation slip boundary,        deformation, cold, hardening reply soon, so is drawn wire bond ( - 0.03-0.016mm ) is an ideal material.

2） 高纯度：目前，在我国的单晶铜丝（原材料）可以做到99.999%（5N）或99.9999%（6N）的纯度；

High purity: at present, in our country the single-crystal copper ( raw materials ) can be 99.999%(5N ) or 99.9999% ( 6N ) purity;

3）机械性能好：与同纯度的金丝相比具有良好的拉伸、剪切强度和延展性。单晶铜丝因其优异的机械电气性能和加工性能，可满足封装新技术工艺，将其加工至￠0.03-0.015mm的单晶铜超细丝代替金丝，从而使引线键合的间距更小、更稳定。

Good mechanical properties: with the purity of gold has good tensile, shear strength and ductility. Copper single crystal due to its excellent mechanical and electrical properties and processing performance, can meet the needs of new packaging technology, its processing to Ranma 0.03-0.015mm single crystal copper ultra fine instead of wire, so that the wire bond spacing smaller, more stable.

4）导电性、导热性好：单晶铜丝的导电率、导热率比金丝提高20%，因此在和金丝径相同的条件下可以承载更大的电流，键合金丝直径小于0.018mm时，其阻抗或电阻特性很难满足封装要求。

Good electrical conductivity, thermal conductivity: single-crystal copper conductivity, thermal conductivity than the wire is increased by 20%, thus in and wire diameter under the same conditions can carry more current, key alloy wire diameter is less than 0.018mm, the impedance or resistance properties is difficult to meet the packaging requirements.

5）低成本：单晶铜键合线成本只有键合金丝的1/3-1/10，可节约键合封装材料成本90%；比重是键合金丝的1/2，1吨单晶铜丝可替代2吨金丝；当今半导体行业的一些显著变化直接影响到了IC互连技术，其中成本因素也是推动互连技术发展的主要因素。目前金丝键合长度超过5mm，引线数达到400以上，其封装成本超过0.2美元。而采用单晶铜丝键合不但能降低器件制造成本，提高竞争优势。对于1密耳焊线，成本最高可降低75%，2密耳可达90%。

Low cost: copper bonding wire costs only bonding gold wire bonding package 1/3-1/10, can save material cost 90%; the proportion of bonding wire 1/2, 1 tons of copper single crystal can replace 2 tons of gold; the semiconductor industry some remarkable changes directly affect the IC interconnect technology, the cost factors but also promote the interconnection technical development of the main factors. The wire bonding length of more than 5mm, lead number to achieve 400 above, the package cost of more than $0.2. The single crystal copper wire bonding can not only reduce the device manufacturing cost, improve the competition advantage. About 1 mils wire bonding, the highest cost can be reduced by 75%, 2 mils up to 90%.