HL-DP半导体打标机HL-DP semi-conductor marking machine
HL-50DP
HL-100DP
【机型简介】Means of indicators
合力半导体激光打标机采用国际上最先进半导体泵浦技术，体积小，能耗低，光模式好，打标更精细，取代灯泵浦激光打标机的新一代打标设备产品可以长时间高负荷运行，光斑精细，功率大，效率高，能耗低，免维护，适合对打标要求高的产品进行高速或在线精密打标。
Heli semiconductor laser marking machine adopts the most advanced semiconductor pump technology, small size, low energy consumption, lightmodel is good, marking a more sophisticated, replace lamp pumped laser marking machine marking a new generation of equipment, products canbe a long time high load, spot fine, big power, high efficiency, low energy consumption, maintenance-free, suitable for rally marked the products that require high precision high-speed or line marking.
【具体特点】Specific features
1.采用全封闭结构的光学系统，光束质量好，转换效率高，配有光路预览和红光焦点指示功能；
2.光模式好，光斑细，通过高精度超速扫描振镜的控制，打标速度快，标记线条更精美；
3.软件功能完善、界面友好，具光路预览功能，直观准确；
4.该机器配备最新的外置水冷系统，运行噪音极低，温度调节精度高，为机器长时间 超负荷运行提供了可靠的保障。
5.具有系统体积小，外形美观大方，采用最新型的外置水冷系统，运行噪音低，温度调节精度高；
6.具有整机运行成本低，安装及操作简便，打标定位精度高，速度快的特点；
7.可在各种金属材质或硬质非金属材料上进行静态精细打标，也可以配合生产流水线进行在线飞行打标。
8.与众不同的光学模式，低阶模输出，光学质量好，刻线更细；
9.性能稳定免维护，适合各种恶劣环境，半导体激光模块使用寿命10000小时以上；
10.光电转换效率高；
11.一体化设计，减少占地面积；
12.模块化设计，易于维修。
13.优化的人机工程，固定的台面，减少体耗。
1.Adopt to closed cycle structure of the optical system, the conversion beam of good quality and efficiency, with a light red indicates a preview of the road and the focal point system function；
2.Light mode is good, spot fine, high-precision control of speed scanning galvanometer, marking speed, marking the line more attractive;
3.Software functional, user-friendly, with optical preview function, intuitive and accurate;
4.The machine is equipped with the latest external water cooling system running extremely low noise, high precision temperature control for the machine to provide a reliable long running overload protection.
5.A small size, is in great shape, use the latest addition to the cold water system, low noise, temperature, and adjust the precision；
6.The integrated equipment running cost is low, the installation and operation simple and direction of high precision, the faster characteristics；
7.In all sorts of metal materials or hard nonmetal material on a specific static, you can also cooperate with the production of an on-line flying in the pipeline
8.Different optical patterns and lower molds output, optical good quality, more fine；
9.Performance from the maintenance of stability for all sorts of adverse circumstances, the semiconductor laser module life, hours or more；
10.Photovoltaic conversion efficiency；
11.Integration design. it covers an area；
12.Modular design, easy to repair;
13.The man-machine engineering, fixed table-board and reduce the consumption.
【详细配置】Detailed configuration
A.可高度适应恶劣环境的工业计算机
B.美国进口射频激光器
C.美国进口透镜及扩束聚焦系统
D.美国进口高档升降平台
E.工业冷水机
F.工业控制计算机及DP半导体电源系统
a.Industrial control computer adapt the bad environment of processing scene
b.High speed scanning vibrating mirror imported from USA
c.Radio frequency CO2laser instrument imported fromUSA
d.F-Olens and expanding bunch system imported fromUSA
e.Industrial water-cooled engine
f.Industrial control computer and the DP semiconductor power system
【技术参数】Technical-parameters
型号/Type HL-50DP HL-100DP
激光类型/Laser type半导体激光模块/semiconductor laser blockset
响应时间/Response time 0.8ms
激光波长/Laser wavelength 1064nm
激光功率/Laser power 0~50w连续可调0~100连续可调
打标范围/Labeling scope 100*100mm 200*200mm(可选/optional)
打标线速/ Labeling speed 7000mm/s
最小线速/ Minimum line width 0.1/0.15mm 0.1/0.15/0.3mm
重复定位精度/Repeating locating ±0.003mm
平均功耗/Average power consumption≤2.5kw≤3.5kw
冷却方式/Cooling mode风冷/Air Cooling水冷/Water Cooling
外形尺寸/Size 1200*600*1250mm 1700*1000*1250mm
重量/GM 100kg 260kg
【适用材料】Applicable Materials
半导体激光打标机可雕刻金属及多种非金属材料,半导体激光打标机适用材料：普通金属及合金（铁、铜、铝、镁、锌等所有金属），稀有金属及合金（金、银、钛），金属氧化物（各种金属氧化物均可），特殊表面处理（磷化、铝阳极化、电镀表面），塑胶及ABS料（电器用品外壳，日用品），油墨（透光按键、印刷制品），环氧树脂（电子元件的封装、绝缘层），陶瓷和硅晶片。
Semiconductor laser marking machine can engraving metals and a variety of non-metallic materials, semiconductor materials, laser marking machine is suitable for: general metals and alloys (iron, copper, aluminum, magnesium, zinc and all other metals), rare metals and alloys (gold, silver , titanium), metal oxide (metal oxide may be), special surface treatment (phosphate, aluminum anodizing, plating surface), plastic and ABS material (electrical appliances, housing, commodities), ink (translucent button printing products), epoxy resin (encapsulation of electronic components, insulation layer), ceramic and silicon chips.
【适用行业】Applicable Industry
电子元器件、集成电路（IC）、塑胶按键、食品或医药包装等进行流水打标;建材、PVC管材、五金制品、乐器、洁具浴具、工具配件、精密器械、眼镜钟表、汽车配件、建材、医疗器械、太阳能等行业产品的打标深加工。
Electronic components, integrated circuits (IC), plastic buttons, food or medicine packaging for water marking; building materials, PVC pipe, hardware, musical instruments, bath ware, tools, accessories, precision instruments, eyeglasses and clocks, auto parts, building materials , medical equipment, solar energy products, marking the industry processing.
