特征：

    体积小，适合高密度表面贴装                                     Minature size ,suitable for SMT

    采用端电极结构，很好地抑制了引线引起的                  Using terninal electrode structure to restrain the pairasitic

    寄生元件效应，具有高可靠性                                      conponent effect quite caused by lead

    优良的焊接性和耐焊性                                               Execellent in solderability and heat rdsistance

    更好的频率特性和抗干扰性                                         Best frequency special property and intense ability to resist

                                                                                    ingerference

应用： 

    移动通信、PDA                                                         Portable communication equipment and PDA

    各种高频回路                                                             High speed electronic device

    抑制各种高频杂波                                                      Used for radiation high speed noise suppression