CI-2015H conductive thermoset carbon ink provides the following product characteristics:
Technology | Thermoset |
Chemical type | Phenolic |
Appearance | Black Paste |
Components | One |
Cure method | Heat Cure |
Typical Application | PCB jumpers and key contacts |
Key Substrates | Rigid phenolic and ceramic PCB |
Other Application | Rigid PCB conductive circuits and through hole |
Application Method | Screen-printing |
CI-2015H is a heat cured carbon paste suitable for jumpers, key contacts, and through hole applications in PCB industries. It has good adhesion to PCB surfaces and excellent abrasion resistance. CI-2015H can mix with CI-2015L to achieve appropriate viscosity and conductivity.
n Advantage
· Excellent electrical conductivity
· Screen-printable and can adhere in wide spectrum of printed circuit boards.
· Excellent abrasion resistance.
· Excellent solvent resistance.
· Possesses fast cure and no dilution is needed.
· It is easy handling and long work life.
n Typical Uncured Material
Viscosity | 350-500 dPas |
Color (Visual) | Black |
Specific Gravity | 1.2 |
Total solid content | 50 ~ 60% |
Maximum Shelf life at 5 °C | 6 months |
n Cure Schedule
Batch oven | IR oven | |
Temperature | 150oC | 165oC |
Cure Time | 30 min | 8 min |
* 1 mil dry film thickness.
n Cured Properties
Electrical resistance | 22 ? / square mil |
Cross hatch | 100/100 |
Printed thickness | 0.8 ~ 1.2 mil |
* 150C, 1 hour cure.
DIRECTION FOR USE
1. Screen print CI-2015H with any screen emulsion / mesh combination that yields a wet film thickness of around 1.5 mils. The cured dry film will then be 0.8 – 1.2 mils
2. Typical screens used are 120 - 220 mesh with a 1.5 mil emulsion
3. Stainless steel fabric can be used to increase dry film thickness
4. Repeating the cure cycle and observing the electrical resistance change can confirm complete cure. The electrical